Inventor · disambiguated record
Cheng-Tien Wan
Also filed as: WAN CHENG-TIEN
18 granted patents·3 pending applications·701 citations·filing 2012–2024
93Inventor score
Files withMEDIATEK INC11TAIWAN SEMICONDUCTOR MFG CO LTD5LEE YI-JING2MEDIATEK SINGAPORE PTE LTD1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
21 records- 0198US8742509B2Apparatus and method for FinFETsLEE YI-JING·Filed 2012·Granted Jun 3, 2014·188 cites·13 claims
- 0297US8815712B2Method for epitaxial re-growth of semiconductor regionWAN CHENG-TIEN·Filed 2012·Granted Aug 26, 2014·477 cites·20 claims
- 0396US11404587B2Semiconductor structureMEDIATEK INC·Filed 2020·Granted Aug 2, 2022·3 cites·14 claims
- 0493US8994002B2FinFET having superlattice stressorLEE YI-JING·Filed 2012·Granted Mar 31, 2015·15 cites·20 claims
- 0592US11923460B2Semiconductor structureMEDIATEK INC·Filed 2022·Granted Mar 5, 2024·1 cites·6 claims
- 0691US10084069B2Apparatus and method for FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 25, 2018·4 cites·20 claims
- 0785US11450756B2Manufacturing method of semiconductor chipMEDIATEK INC·Filed 2020·Granted Sep 20, 2022·1 cites·3 claims
- 0885US9559099B2Apparatus and method for FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 31, 2017·5 cites·19 claims
- 0984US11189694B2Semiconductor devices and methods of forming the sameMEDIATEK INC·Filed 2019·Granted Nov 30, 2021·2 cites·11 claims
- 1082US12272755B2Semiconductor structureMEDIATEK INC·Filed 2024·Granted Apr 8, 2025·0 cites·23 claims
- 1182US10790380B2Semiconductor chip and manufacturing method thereofMEDIATEK INC·Filed 2018·Granted Sep 29, 2020·2 cites·12 claims
- 1278US9153582B2Apparatus and method for FinFETsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 6, 2015·2 cites·20 claims
- 1377US11916108B2Semiconductor devices and methods of forming the sameMEDIATEK INC·Filed 2023·Granted Feb 27, 2024·0 cites·11 claims
- 1475US12237401B2Semiconductor chipMEDIATEK INC·Filed 2022·Granted Feb 25, 2025·0 cites·11 claims
- 1572US11600700B2Semiconductor devices and methods of forming the sameMEDIATEK INC·Filed 2021·Granted Mar 7, 2023·0 cites·11 claims
- 1667US9450098B2FinFET having superlattice stressorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·1 cites·20 claims
- 1762US2025174497A1Die-Level Parametric Prediction Boosting Method and System for Improving Prediction Accuracy by Incorporating Physical Location Parametric DataMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1861US2025174498A1Die-Level Parametric Prediction Boosting Method and Die-Level Parametric Prediction Boosting System for Improving Prediction Accuracy by Incorporating a Wafer Map DistributionMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1958US9722051B2Apparatus and method for FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·20 claims
- 2053US9922828B2Apparatus and method for FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 20, 2018·0 cites·20 claims
- 2146US2024345941A1Core test method and core test circuitMEDIATEK SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →