Inventor · disambiguated record
Chien-Hao Wang
Also filed as: WANG CHIEN-HAO
36 granted patents·8 pending applications·182 citations·filing 2006–2025
96Inventor score
Files withADVANCED SEMICONDUCTOR ENG24UNIV NAT TAIWAN7WANG CHIEN-HAO6TEXAS INSTRUMENTS INC3CHEN MIN-YAO1
Top patents by PatentIndex Score
44 records- 0197US8372689B2Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 12, 2013·42 cites·20 claims
- 0295US8320134B2Embedded component substrate and manufacturing methods thereofSU YUAN-CHANG·Filed 2010·Granted Nov 27, 2012·35 cites·20 claims
- 0394US7550320B2Method of fabricating substrate with embedded component thereinADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 23, 2009·25 cites·15 claims
- 0488US7728234B2Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 1, 2010·16 cites·15 claims
- 0587US7591067B2Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 22, 2009·17 cites·11 claims
- 0687US7436680B2Multi-chip build-up package of optoelectronic chipADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 14, 2008·10 cites·15 claims
- 0786US12267961B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0883US2025227849A1Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0981US11882660B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Jan 23, 2024·0 cites·20 claims
- 1081US8416577B2Coreless substrate and method for making the sameWANG CHIEN-HAO·Filed 2010·Granted Apr 9, 2013·5 cites·14 claims
- 1176US8132320B2Circuit board processWANG CHIEN-HAO·Filed 2009·Granted Mar 13, 2012·7 cites·10 claims
- 1274US11553596B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 10, 2023·0 cites·17 claims
- 1374US10560529B2Vehicle information and environment monitoring compound vehicle system and data processing and transmission method thereinUNIV NAT TAIWAN·Filed 2017·Granted Feb 11, 2020·2 cites·11 claims
- 1474US8510940B2Method of fabricating a multi-trace via substrateCHEN MIN-YAO·Filed 2010·Granted Aug 20, 2013·5 cites·19 claims
- 1572US11032911B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 8, 2021·0 cites·19 claims
- 1672US10726956B2Fever epidemic detection system and method thereofUNIV NAT TAIWAN·Filed 2016·Granted Jul 28, 2020·4 cites·3 claims
- 1768US7968992B2Multi-chip package structure and method of fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jun 28, 2011·2 cites·16 claims
- 1863US8178156B2Surface treatment process for circuit boardWANG CHIEN-HAO·Filed 2009·Granted May 15, 2012·2 cites·7 claims
- 1962US7748111B2Manufacturing process of a carrierADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jul 6, 2010·4 cites·13 claims
- 2061US10757813B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Aug 25, 2020·0 cites·26 claims
- 2161US7849594B2Manufacturing method for integrating passive component within substrateADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Dec 14, 2010·2 cites·19 claims
- 2261US7754980B2Substrate with multilayer plated through hole and method for forming the multilayer plated through holeADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jul 13, 2010·1 cites·4 claims
- 2358US7999380B2Process for manufacturing substrate with bumps and substrate structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Aug 16, 2011·1 cites·14 claims
- 2457US10429174B2Single wavelength reflection for leadframe brightness measurementTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 1, 2019·0 cites·27 claims
- 2557US10139444B2Sensing circuit, sensing device and monitoring system for power transmission linesUNIV NAT TAIWAN·Filed 2016·Granted Nov 27, 2018·1 cites·7 claims
- 2657US8387239B2Manufacturing method of embedded circuit substrateWANG CHIEN-HAO·Filed 2009·Granted Mar 5, 2013·1 cites·15 claims
- 2755US12062596B2Semiconductor die with stepped side surfaceTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 13, 2024·0 cites·22 claims
- 2855US7825500B2Manufacturing process and structure for embedded semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 2, 2010·0 cites·10 claims
- 2953US10950551B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 3053US8671562B2Method for manufacturing a circuit boardWANG CHIEN HAO·Filed 2007·Granted Mar 18, 2014·0 cites·20 claims
- 3153US2015047254A1Energy-saving type plant cultivation systemUNIV NAT TAIWAN·Filed 2014·Application pending·0 cites
- 3252US11421981B2Single wavelength reflection for leadframe brightness measurementTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 23, 2022·0 cites·16 claims
- 3352US7923299B2Manufacturing process for embedded semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Apr 12, 2011·0 cites·20 claims
- 3450US2015366169A1Honeybee behavior monitoring sevice and honeybee behavior monitoring systemUNIV NAT TAIWAN·Filed 2014·Application pending·0 cites
- 3549US11296030B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 5, 2022·0 cites·18 claims
- 3649US2018177159A1Bee-keeping equipment and temperature adjusting device thereofUNIV NAT TAIWAN·Filed 2017·Application pending·0 cites
- 3749US2008271915A1Method for making a circuit board and multi-layer substrate with plated through holesADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 3848US8273601B2Method of fabricating multi-chip package structureWANG CHIEN-HAO·Filed 2011·Granted Sep 25, 2012·0 cites·20 claims
- 3948US2008178464A1Method for fabricating circuit boardADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 4047US2007164449A1Build-up package of optoelectronic chipADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 4146US8895368B2Method for manufacturing chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Nov 25, 2014·0 cites·20 claims
- 4245US11277917B2Embedded component package structure, embedded type panel substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·0 cites·10 claims
- 4342US9680935B2Grid gateway and transmission tower management system with multiple grid gatewaysUNIV NAT TAIWAN·Filed 2014·Granted Jun 13, 2017·0 cites·9 claims
- 4440US2010102447A1Substrate of window ball grid array package and method for making the sameHUANG CHIH-YI·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →