Inventor · disambiguated record
Chienhao Wang
Also filed as: WANG CHIENHAO
4 granted patents·11 citations·filing 2019–2023
69Inventor score
Files withTEXAS INSTRUMENTS INC4
Top patents by PatentIndex Score
4 records- 0192US11791289B2Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor dieTEXAS INSTRUMENTS INC·Filed 2022·Granted Oct 17, 2023·2 cites·13 claims
- 0290US11302652B2Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor dieTEXAS INSTRUMENTS INC·Filed 2019·Granted Apr 12, 2022·8 cites·20 claims
- 0380US12476204B2Semiconductor package substrate with groove on die padTEXAS INSTRUMENTS INC·Filed 2023·Granted Nov 18, 2025·0 cites·18 claims
- 0466US10910293B1Leadframe with die pad having cantilevers to secure electronic componentTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 2, 2021·1 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →