Inventor · disambiguated record
Chunshui Wang
Also filed as: WANG CHUNSHUI
1 granted patent·1 pending application·0 citations·filing 2024–2024
5Inventor score
Files withWUHAN NEURACOM TECH DEVELOPMENT CO LTD2
Top patents by PatentIndex Score
2 records- 0165US12434315B2Reverse soldering connection structure of microneedle and wiring and preparation process thereforWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·6 claims
- 0248US2024351859A1Connection line structure and forming method thereofWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →