Inventor · disambiguated record
Chin-Fa Wang
Also filed as: WANG CHIN-FA
9 granted patents·5 pending applications·50 citations·filing 2003–2015
84Inventor score
Files withPOWERTECH TECHNOLOGY INC7WANG CHIN-FA3CHEN CHIN-TI1DIGILIFE TECH CO LTD1SILICONWARE PREC IND LTD1
Top patents by PatentIndex Score
14 records- 0185US7564123B1Semiconductor package with fastened leadsPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jul 21, 2009·16 cites·20 claims
- 0282US7884472B2Semiconductor package having substrate ID code and its fabricating methodPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Feb 8, 2011·13 cites·6 claims
- 0381US8125063B2COL package having small chip hidden between leadsWANG CHIN-FA·Filed 2010·Granted Feb 28, 2012·9 cites·20 claims
- 0473US7619307B1Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Nov 17, 2009·7 cites·14 claims
- 0556US7549568B1Method of forming identification code for wire-bonding machinesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jun 23, 2009·1 cites·10 claims
- 0652US7279439B2Rug structureWANG CHIN-FA·Filed 2005·Granted Oct 9, 2007·0 cites·1 claims
- 0747US8040690B2Inner-connecting structure of lead frame and its connecting methodPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Oct 18, 2011·0 cites·10 claims
- 0847US7812430B2Leadframe and semiconductor package having downset baffle paddlesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Oct 12, 2010·0 cites·18 claims
- 0942US2009236710A1Col semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 1042US2009261463A1Chip mounting device and chip package arrayCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 1141US2005274101A1Rope structureWANG CHIN-FA·Filed 2004·Application pending·0 cites
- 1240US2006128040A1Bond positioning method for wire-bonding process and substrate for the bond positioning methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites
- 1337US6903441B2Semiconductor package with enhanced chip groundability and method of fabricating the sameSILICONWARE PREC IND LTD·Filed 2003·Granted Jun 7, 2005·4 cites·19 claims
- 1428US2016277625A1Image capture device capable of uploading clear images via wireless transmissionDIGILIFE TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →