Inventor · disambiguated record
Chuei-Tang Wang
Also filed as: WANG CHUEI-TANG
224 granted patents·63 pending applications·1,047 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD274TAIWAN SEMICONDUCTOR MFG8KUO FENG WEI1PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC1UNIV SCIENT IND CO LTD1
Top patents by PatentIndex Score
287 records- 0199US11587916B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·8 cites·20 claims
- 0299US10504835B1Package structure, semiconductor chip and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·64 cites·20 claims
- 0399US10162139B1Semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·96 cites·20 claims
- 0499US9831148B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·104 cites·20 claims
- 0598US11769731B2Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·4 cites·20 claims
- 0698US11456251B2Semiconductor structure, package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0798US11362077B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 14, 2022·4 cites·20 claims
- 0898US11282816B2Memory packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·6 cites·20 claims
- 0998US11244939B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·7 cites·20 claims
- 1098US10267990B1Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·33 cites·20 claims
- 1198US10157834B1Electronic apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 1298US10153239B2Antennas and waveguides in InFO structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·59 cites·20 claims
- 1398US9373605B1DIE packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·30 cites·20 claims
- 1497US12327796B2Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 10, 2025·2 cites·20 claims
- 1597US11855046B2Memory packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·3 cites·20 claims
- 1697US11841541B2Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 12, 2023·5 cites·20 claims
- 1797US11417698B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 1897US11404316B2System, device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·4 cites·20 claims
- 1997US11387222B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·5 cites·20 claims
- 2097US11302649B2Semiconductor device with shielding structure for cross-talk reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·6 cites·20 claims
- 2197US11211360B2Passive device module, semiconductor package including the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·8 cites·20 claims
- 2297US10777518B1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·19 cites·20 claims
- 2397US9407184B2Energy harvesting deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 2, 2016·19 cites·20 claims
- 2496US11948926B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·2 cites·20 claims
- 2596US11908787B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 2696US11488909B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·4 cites·20 claims
- 2796US10867938B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·16 cites·20 claims
- 2896US10371893B2Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·14 cites·20 claims
- 2996US10163852B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·13 cites·20 claims
- 3096US9431369B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 30, 2016·29 cites·15 claims
- 3196US9396300B2Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·20 cites·20 claims
- 3295US11637097B2Method of manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 25, 2023·2 cites·20 claims
- 3395US11450628B2Package structure including a solenoid inductor laterally aside a die and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·4 cites·20 claims
- 3495US10796990B2Semiconductor structure, package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·9 cites·20 claims
- 3595US10679947B2Chip package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·8 cites·20 claims
- 3694US12125798B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·2 cites·20 claims
- 3794US12094860B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·1 cites·20 claims
- 3894US12021047B2Semiconductor packages having a die, an encapsulant, and a redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 3994US11923315B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 4094US11424197B2Package, package structure with redistributing circuits and antenna elements and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·8 cites·20 claims
- 4194US11315891B2Methods of forming semiconductor packages having a die with an encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 26, 2022·11 cites·20 claims
- 4294US10134708B2Package with thinned substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·9 cites·20 claims
- 4394US9337073B23D shielding case and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 10, 2016·17 cites·20 claims
- 4493US11527486B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·2 cites·20 claims
- 4593US10672728B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·6 cites·20 claims
- 4693US10510679B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·7 cites·20 claims
- 4793US10481351B2Semicondcutor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·20 claims
- 4893US10366966B1Method of manufacturing integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 30, 2019·8 cites·20 claims
- 4993US10115685B2Method of manufacturing a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 30, 2018·6 cites·20 claims
- 5093US10074472B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 11, 2018·8 cites·20 claims
Showing the top 50 of 287 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →