Inventor · disambiguated record
Chien-Chang Wang
Also filed as: WANG CHIEN-CHANG
7 granted patents·22 pending applications·68 citations·filing 2002–2025
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15IND TECH RES INST3HUANG CHUNG CHUN2MEDIATEK INC2TOPPOLY OPTOELECTRONICS CORP2
Top patents by PatentIndex Score
29 records- 0189US8608463B2Micro cooling fanHUANG CHUNG CHUN·Filed 2012·Granted Dec 17, 2013·11 cites·2 claims
- 0286US10243437B2Permanent magnet rotor and permanent magnet rotary assemblyIND TECH RES INST·Filed 2016·Granted Mar 26, 2019·3 cites·11 claims
- 0384US8536970B2Multilayered miniature coil componentLIANG KUN-YI·Filed 2012·Granted Sep 17, 2013·8 cites·18 claims
- 0476US7038341B1Magnetic suspension bearing with damping systemIND TECH RES INST·Filed 2004·Granted May 2, 2006·16 cites·8 claims
- 0575US2025343084A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0674US7135798B2Magnetic suspension bearingIND TECHNOLOGY RESERACH INST·Filed 2005·Granted Nov 14, 2006·9 cites·17 claims
- 0774US2025357270A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0873US6703736B2Magnetic bearingIND TECH RES INST·Filed 2002·Granted Mar 9, 2004·19 cites·9 claims
- 0973US2025349657A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1072US2025336768A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1172US2025343103A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1271US2025210420A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1368US2025201652A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1468US2025210458A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1567US2025218895A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1667US2025201658A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1765US8684709B2Micro cooling fanHUANG CHUNG-CHUN·Filed 2010·Granted Apr 1, 2014·2 cites·8 claims
- 1856US2025221310A1Adaptive liquid cooling system for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1956US2025372475A1Heat-Dissipating Lid ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2056US2025349663A1Heat spreader structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2156US2025351293A1Dynamic liquid cooling for integrated deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2255US2025309071A1Spacer frame for graphite thermal interface materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2354US2007243152A1Formula for fabricating skin treatment product and forming method thereofWANG CHIEN-CHANG·Filed 2006·Application pending·0 cites
- 2444US2023081804A1Display device and thin film transistor array substrateCENTURY TECH SHENZHEN CORPORATION LIMITED·Filed 2022·Application pending·0 cites
- 2541US2018324439A1Method and apparatus for adaptive video encodingMEDIATEK INC·Filed 2018·Application pending·0 cites
- 2639US2004228113A1Reflective circuit board, and light module and flat panel display including the reflective circuit boardTOPPOLY OPTOELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 2737US2018160119A1Method and Apparatus for Adaptive Region-Based Decoding to Enhance User Experience for 360-degree VR VideoMEDIATEK INC·Filed 2017·Application pending·0 cites
- 2837US2004227421A1Magnetic suspension bearingFiled 2003·Application pending·0 cites
- 2935US2004212981A1LED lighting moduleTOPPOLY OPTOELECTRONICS CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →