Inventor · disambiguated record
Chun-Chieh Wang
Also filed as: WANG CHUN · WANG CHUN-CHIEH
184 granted patents·89 pending applications·615 citations·filing 1992–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD55ACER INC25IND TECH RES INST18WANG CHUN-CHIEH14MSTAR SEMICONDUCTOR INC13
Top patents by PatentIndex Score
273 records- 0197US10206094B1Mobile edge platform servers and UE context migration management methods thereofIND TECH RES INST·Filed 2017·Granted Feb 12, 2019·36 cites·20 claims
- 0296US12025382B2Vapor chamber structureACER INC·Filed 2021·Granted Jul 2, 2024·4 cites·8 claims
- 0396US11775034B2Heat dissipation system of portable electronic deviceACER INC·Filed 2022·Granted Oct 3, 2023·6 cites·11 claims
- 0495US11946483B2FanACER INC·Filed 2023·Granted Apr 2, 2024·3 cites·9 claims
- 0595US10535523B1Formation and in-situ etching processes for metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·12 cites·20 claims
- 0695US9899273B1Semiconductor structure with dopants diffuse protection and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·13 cites·20 claims
- 0794US11852158B1Fan and impellerACER INC·Filed 2023·Granted Dec 26, 2023·2 cites·12 claims
- 0894US11466674B2Air flow generating deviceWISTRON CORP·Filed 2021·Granted Oct 11, 2022·20 cites·6 claims
- 0993US10535736B2Fully strained channelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·6 cites·20 claims
- 1093US9992912B1Heat dissipating device combined structureWANG CHUN CHIEH·Filed 2017·Granted Jun 5, 2018·10 cites·5 claims
- 1193US9162869B1MEMS microphone package structure having non-planar substrate and method of manufacturing sameMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Oct 20, 2015·16 cites·2 claims
- 1291US12140159B2Heat dissipation system of electronic deviceACER INC·Filed 2024·Granted Nov 12, 2024·1 cites·8 claims
- 1390US11011433B2NMOS and PMOS transistor gates with hafnium oxide layers and lanthanum oxide layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·2 cites·20 claims
- 1490US10164100B2Formation method and structure semiconductor device with source/drain structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·4 cites·20 claims
- 1590USD684269SLED spa light deviceWANG CHUN-CHIEH·Filed 2012·Granted Jun 11, 2013·86 cites·1 claims
- 1690US7389664B1Electromagnetic forming device for sheet of materialMETAL IND RES & DEV CT·Filed 2007·Granted Jun 24, 2008·20 cites·14 claims
- 1789US11719252B2FanACER INC·Filed 2022·Granted Aug 8, 2023·2 cites·13 claims
- 1888US12446255B2Semiconductor structure with source/drain multi-layer structure and method for forming the samePARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2024·Granted Oct 14, 2025·0 cites·16 claims
- 1988US11410889B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·2 cites·20 claims
- 2088US10910468B2Capacitor structureWINBOND ELECTRONICS CORP·Filed 2020·Granted Feb 2, 2021·2 cites·6 claims
- 2188US8841766B2Cu pillar bump with non-metal sidewall protection structureHWANG CHIEN LING·Filed 2010·Granted Sep 23, 2014·8 cites·20 claims
- 2287US8689398B2Cleaning apparatus and detecting method thereofCHUNG YU-LIANG·Filed 2012·Granted Apr 8, 2014·16 cites·9 claims
- 2387US8392539B1Operating system banking and portabilityCHEN SHIH-YUN·Filed 2008·Granted Mar 5, 2013·22 cites·31 claims
- 2487US7545510B2Method of characterizing transparent thin-films using differential optical sectioning interference microscopyACADEMIA SINICA·Filed 2007·Granted Jun 9, 2009·13 cites·36 claims
- 2586US11914432B2Portable electronic deviceACER INC·Filed 2022·Granted Feb 27, 2024·1 cites·7 claims
- 2686US11885876B2Underwater ultrasonic deviceQISDA CORP·Filed 2020·Granted Jan 30, 2024·3 cites·6 claims
- 2786US11545363B2Formation and in-situ etching processes for metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·1 cites·20 claims
- 2886US10629496B2Methods for forming transistor gates with hafnium oxide layers and lanthanum oxide layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·3 cites·20 claims
- 2986US10468530B2Semiconductor structure with source/drain multi-layer structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 3085US9036838B2Dual-diaphragm acoustic transducerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Granted May 19, 2015·9 cites·7 claims
- 3185US8201247B1Method and apparatus for providing a computer security service via instant messagingCHEN SHIH-YUN·Filed 2008·Granted Jun 12, 2012·17 cites·6 claims
- 3285US2024363350A1Formation and in-situ etching processes for metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3384US11913472B2Centrifugal heat dissipation fan and heat dissipation system of electronic deviceACER INC·Filed 2021·Granted Feb 27, 2024·1 cites·10 claims
- 3484US11777212B2Antenna structureHTC CORP·Filed 2022·Granted Oct 3, 2023·1 cites·8 claims
- 3584US11232945B2Conductive feature formation and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·1 cites·20 claims
- 3684US2024371941A1Fully strained channelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3783US11990550B2Semiconductor structure with source/drain multi-layer structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 3883US11502601B2Control circuit and control method of power converterUPI SEMICONDUCTOR CORP·Filed 2021·Granted Nov 15, 2022·1 cites·19 claims
- 3983US11233123B2Fully strained channelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·1 cites·20 claims
- 4083US2025366164A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4182US12170202B2Formation and in-situ etching processes for metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 4282US11742404B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·1 cites·20 claims
- 4382US10879396B2Semiconductor device with source/drain structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·1 cites·20 claims
- 4482US10867799B2FinFET device and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·20 claims
- 4582US9974052B2Cell and method and system for bandwidth management of backhaul network of cellIND TECH RES INST·Filed 2015·Granted May 15, 2018·4 cites·20 claims
- 4682US9369808B2Acoustic transducer with high sensitivityMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Granted Jun 14, 2016·7 cites·14 claims
- 4782US9193581B1MEMS microphone package structure having an improved carrier and a method of manufacturing sameMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Nov 24, 2015·6 cites·9 claims
- 4882US9162614B1Illuminated running board for vehicleDESITY TRAFFIC IND CO LTD·Filed 2014·Granted Oct 20, 2015·6 cites·13 claims
- 4982US8735255B2Method of manufacturing semiconductor deviceHSIAO WEN CHU·Filed 2012·Granted May 27, 2014·6 cites·20 claims
- 5081US10517020B2Mobile edge platform servers and user equipment context migration management methods thereofIND TECH RES INST·Filed 2017·Granted Dec 24, 2019·3 cites·16 claims
Showing the top 50 of 273 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →