Inventor · disambiguated record
Chung-Pao Wang
Also filed as: WANG CHUNG-PAO
3 granted patents·8 pending applications·25 citations·filing 2000–2018
62Inventor score
Top patents by PatentIndex Score
11 records- 0173US6441501B1Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweepSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 27, 2002·23 cites·4 claims
- 0247US7535091B2Multichip stacking structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted May 19, 2009·2 cites·10 claims
- 0339US2007170572A1Multichip stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 0437US2007166884A1Circuit board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 0535US2008305579A1Method for fabricating semiconductor device installed with passive componentsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 0634US2008099902A1Insertion-type semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 0733US9480171B2Printing circuit board with traces in an insulatorWANG CHUNG-PAO·Filed 2014·Granted Oct 25, 2016·0 cites·17 claims
- 0833US2008179726A1Multi-chip semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 0928US2019074247A1Printed circuit board and method of packaging the sameWANG CHUNG PAO·Filed 2018·Application pending·0 cites
- 1027US2019189467A1Structure of printed circuit board and carrier and method of making semiconductor packageWANG CHUNG PAO·Filed 2018·Application pending·0 cites
- 1123US2016309574A1Printed circuit boardWANG CHUNG-PAO·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chung-Pao Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →