Inventor · disambiguated record
Cheng-Yu Wang
Also filed as: WANG CHENG · WANG CHENG-YU
61 granted patents·32 pending applications·1,118 citations·filing 2003–2025
98Inventor score
Files withASUSTEK COMP INC14WANG CHENG-YU13QUANTA COMP INC6AU OPTRONICS CORP5FULIAN PREC ELECTRONICS TIANJIN CO LTD5
Top patents by PatentIndex Score
93 records- 0196US10632489B1Sticking elimination method for and structure of the water control valve of a water spraying timerWang cheng yu·Filed 2018·Granted Apr 28, 2020·11 cites·8 claims
- 0296US9313915B2Electronic deviceASUSTEK COMP INC·Filed 2013·Granted Apr 12, 2016·804 cites·3 claims
- 0396US7209349B2Heat dissipation deviceQUANTA COMP INC·Filed 2005·Granted Apr 24, 2007·94 cites·9 claims
- 0493US11452232B2Electronic deviceASUSTEK COMP INC·Filed 2020·Granted Sep 20, 2022·4 cites·8 claims
- 0593USD943791SHand lampWang cheng yu·Filed 2020·Granted Feb 15, 2022·19 cites·1 claims
- 0686US7284952B2Centrifugal fanQUANTA COMP INC·Filed 2005·Granted Oct 23, 2007·16 cites·15 claims
- 0786US6956464B2Power apparatus having built-in powerline networking adapterABOCOM SYS INC·Filed 2003·Granted Oct 18, 2005·58 cites·9 claims
- 0885US7312997B2Heat-dissipation device with elastic member and heat-dissipation method thereofQUANTA COMP INC·Filed 2005·Granted Dec 25, 2007·15 cites·6 claims
- 0982USD911564SHand lampWang cheng yu·Filed 2019·Granted Feb 23, 2021·19 cites·1 claims
- 1082US9341195B2Centrifugal fan module and electronic device using the centrifugal fan moduleASUSTEK COMP INC·Filed 2014·Granted May 17, 2016·6 cites·14 claims
- 1180US7251134B2Extended fin arrayQUANTA COMP INC·Filed 2005·Granted Jul 31, 2007·11 cites·8 claims
- 1279US9087804B2Heat dissipating module and heat dissipating method thereofWONG CHUN-CHIEH·Filed 2012·Granted Jul 21, 2015·7 cites·5 claims
- 1378USD682715STimer panel for sprinklerWANG CHENG-YU·Filed 2013·Granted May 21, 2013·22 cites·1 claims
- 1477US10396196B1Semiconductor devicesVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Aug 27, 2019·3 cites·10 claims
- 1577US8760862B2Heat dissipating device and portable electronic device using the sameWANG CHENG-YU·Filed 2012·Granted Jun 24, 2014·4 cites·12 claims
- 1677US7191822B2Aluminum extruded fin set with noise reduction functionalityQUANTA COMP INC·Filed 2005·Granted Mar 20, 2007·8 cites·9 claims
- 1774US10032631B1Method of fabricating mask patternUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 24, 2018·2 cites·9 claims
- 1874US9173335B2Complex circuit board fabrication methodAU OPTRONICS CORP·Filed 2013·Granted Oct 27, 2015·2 cites·8 claims
- 1972US12439533B2Heat insulation pad and electronic device with heat insulation padASUSTEK COMP INC·Filed 2023·Granted Oct 7, 2025·0 cites·11 claims
- 2072US11625258B2Method, apparatus and system for real-time virtual network function orchestrationNOKIA SOLUTIONS & NETWORKS OY·Filed 2017·Granted Apr 11, 2023·2 cites·7 claims
- 2163US9342110B2Heat dissipating deviceWONG CHUN-CHIEH·Filed 2011·Granted May 17, 2016·2 cites·6 claims
- 2263US8570765B2Circuit board with via hole and electronic device equipped with the sameWANG CHENG-YU·Filed 2010·Granted Oct 29, 2013·1 cites·7 claims
- 2361US2025323338A1Liquid-cooling heat dissipation plate and the lithium battery module containing the sameTOP RANK TECH LIMITED·Filed 2024·Application pending·0 cites
- 2460US2025173186A1Method and device for resource allocation of cloud platformFULIAN PREC ELECTRONICS TIANJIN CO LTD·Filed 2024·Application pending·0 cites
- 2560US2025308515A1Method, device, and computer-readable storage medium for intelligent interactionFULIAN PREC ELECTRONICS TIANJIN CO LTD·Filed 2024·Application pending·0 cites
- 2657US2024321858A1Semiconductor device and method for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2023·Application pending·0 cites
- 2756US12153249B2Display deviceAUO CORP·Filed 2022·Granted Nov 26, 2024·0 cites·23 claims
- 2856US12039093B2Encrypted hard disk deviceASUSTEK COMP INC·Filed 2022·Granted Jul 16, 2024·0 cites·10 claims
- 2956US2024019836A1Method for managing motion information, electronic device, and storage mediumFULIAN PREC ELECTRONICS TIANJIN CO LTD·Filed 2023·Application pending·0 cites
- 3055US2025238269A1Data processing method, terminal device, and readable storage mediumHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 3155US2025324539A1Liquid cooling heat dissipation systemTOP RANK TECH LIMITED·Filed 2024·Application pending·0 cites
- 3255US2024362613A1Order payment method and apparatus, and storage medium, device and systemZTE CORP·Filed 2022·Application pending·0 cites
- 3354US12504236B2Liquid cooling vapor chamber heat dissipation moduleTOP RANK TECH LIMITED·Filed 2024·Granted Dec 23, 2025·0 cites·14 claims
- 3453USD899945SSprinkler timerWang cheng yu·Filed 2018·Granted Oct 27, 2020·5 cites·1 claims
- 3552US2015173233A1Display ModulesAU OPTRONICS CORP·Filed 2014·Application pending·0 cites
- 3651US10885595B2Food depositing systemHONGFUJIN PREC ELECTRONICS TIANJIN CO LTD·Filed 2018·Granted Jan 5, 2021·0 cites·14 claims
- 3751US8888353B2Backlight module and assembly method thereofAU OPTRONICS CORP·Filed 2012·Granted Nov 18, 2014·0 cites·19 claims
- 3851US7927693B2High capacity hydrogen storage material and method of making the sameINER AEC EXECUTIVE YUAN·Filed 2008·Granted Apr 19, 2011·1 cites·15 claims
- 3951US2010252668A1Cutter for cutting scrap wireHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 4050US12320593B2Integrated vapor chamberTOP RANK TECH LIMITED·Filed 2023·Granted Jun 3, 2025·0 cites·12 claims
- 4150US8284555B2Heat-dissipated fastener and elastic frame thereofWANG CHENG-YU·Filed 2009·Granted Oct 9, 2012·0 cites·14 claims
- 4249US11356347B2Method and apparatus for monitoring performance of virtualized network functionsALCATEL LUCENT·Filed 2018·Granted Jun 7, 2022·0 cites·17 claims
- 4349US11172594B2Heat dissipation structureASUSTEK COMP INC·Filed 2020·Granted Nov 9, 2021·0 cites·8 claims
- 4449US8953319B2Heat-dissipating moduleWANG CHENG-YU·Filed 2012·Granted Feb 10, 2015·0 cites·10 claims
- 4549US2024232101A9Logic control device of serial peripheral interface, master-slave system, and master-slave switchover method therforNETRONIX INC·Filed 2022·Application pending·0 cites
- 4649US2024298425A1Integrated heat dissipation module structureTOP RANK TECH LIMITED·Filed 2023·Application pending·0 cites
- 4748US12447481B2Nozzle structure with forward and reverse water sealingNINGBO YANGTENG XINGYE MACHINERY CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·5 claims
- 4848US9210820B2Electronic deviceWONG CHUN-CHIEH·Filed 2012·Granted Dec 8, 2015·0 cites·4 claims
- 4948US8979348B2Backlight module and light source module thereofAU OPTRONICS CORP·Filed 2012·Granted Mar 17, 2015·0 cites·20 claims
- 5048US8958981B2Near field communication mobile device and navigation device communication systemWANG CHENG-YU·Filed 2012·Granted Feb 17, 2015·0 cites·20 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →