Inventor · disambiguated record
Chun-Yen Wei
Also filed as: WEI CHUN · WEI CHUN YEN
7 granted patents·6 pending applications·6 citations·filing 2019–2025
74Inventor score
Files withNANYA TECHNOLOGY CORP11TAIWAN SEMICONDUCTOR MFG CO LTD1TECH ON PROTOTYPING ULTIMATE CO LTD1
Top patents by PatentIndex Score
13 records- 0190US12125800B2Semiconductor device structure including overlay mark structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Oct 22, 2024·2 cites·12 claims
- 0289US12369439B2Method for manufacturing semiconductor device structure including an overlay mark structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Jul 22, 2025·2 cites·17 claims
- 0389US12243832B2Method for manufacturing semiconductor device structure with overlay marksNANYA TECHNOLOGY CORP·Filed 2022·Granted Mar 4, 2025·2 cites·14 claims
- 0478US2025278027A1Method and system for overlay measurementNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0571US2025006656A1Semiconductor device structure including overlay mark structureNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0670US12481224B2Method and system for overlay measurementNANYA TECHNOLOGY CORP·Filed 2022·Granted Nov 25, 2025·0 cites·15 claims
- 0768US2025157923A1Cutting structure, semiconductor device comprising the same, and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0868US2025157924A1Cutting structure, semiconductor device comprising the same, and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0967US12436469B2Measuring method for measuring overlay shift and non-transient computer readable storage mediumNANYA TECHNOLOGY CORP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 1059US12259658B2Semiconductor device with grating structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Mar 25, 2025·0 cites·13 claims
- 1156US12354970B2Semiconductor device structure with overlay markNANYA TECHNOLOGY CORP·Filed 2022·Granted Jul 8, 2025·0 cites·16 claims
- 1255US2025360455A1System and method for carbon capture in a semiconductor fabrication facilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1331US2020178575A1High hydrostatic pressure processing method and apparatusTECH ON PROTOTYPING ULTIMATE CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →