Inventor · disambiguated record
Cheng-Chang Wei
Also filed as: WEI CHENG-CHANG
6 granted patents·2 pending applications·16 citations·filing 2010–2020
77Inventor score
Top patents by PatentIndex Score
8 records- 0192US9455183B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 27, 2016·10 cites·22 claims
- 0285US9960134B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·3 cites·20 claims
- 0380US10644153B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 5, 2020·3 cites·20 claims
- 0465US11348889B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 0563US11171235B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 0660US10522491B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 0750US2011186989A1Semiconductor Device and Bump Formation ProcessTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
- 0839US2013221074A1Solder bump stretching methodWEI CHENG-CHANG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →