Inventor · disambiguated record
Chih-Nan Wei
Also filed as: WEI CHIH-NAN
3 granted patents·1 pending application·8 citations·filing 2006–2009
57Inventor score
Top patents by PatentIndex Score
4 records- 0173US7547575B2Two-stage die-bonding method for simultaneous die-bonding of multiple diesADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 16, 2009·7 cites·6 claims
- 0255US7581666B2Wire-bonding method for wire-bonding apparatusADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 1, 2009·1 cites·6 claims
- 0342US8783875B2Light compensation scheme, optical machine device, display system and method for light compensationPERNG NEI-CHIUNG·Filed 2009·Granted Jul 22, 2014·0 cites·30 claims
- 0440US2008035706A1Wire-bonding apparatus and wire-bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →