Inventor · disambiguated record
Cheng-Hui Weng
Also filed as: WENG CHENG-HUI
10 granted patents·7 pending applications·6 citations·filing 2011–2025
80Inventor score
Top patents by PatentIndex Score
17 records- 0194US11676898B2Diffusion barrier for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·4 cites·16 claims
- 0286US11854878B2Bi-layer alloy liner for interconnect metallization and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·2 cites·20 claims
- 0378US12354910B2Bi-layer alloy liner for interconnect metallization and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0476US2025357323A1Interconnect structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0576US2024395617A1Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF FORMING THE SAMETAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0674US2024350289A1Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0773US12347728B2Bi-layer alloy liner for interconnect metallization and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0872US12080594B2Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 0972US2024387256A1Ruthenium-based liner for a copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1070US2025259889A1Interconnect Structure of Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1167US12322649B2Interconnect structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1267US11430692B2Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 1366US12094770B2Ruthenium-based liner for a copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 1464US2022367376A1Diffusion Barrier for Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1550US2023042277A1Semiconductor processing tool and method for passivation layer formation and removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1644US8951909B2Integrated circuit structure and formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·0 cites·20 claims
- 1741US8367545B2System and method for monitoring copper barrier layer preclean processTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 5, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →