Inventor · disambiguated record
Ching-Ping Wong
Also filed as: WONG CHING P · WONG CHING PING
64 granted patents·5 pending applications·1,340 citations·filing 1978–2024
99Inventor score
Files withGEORGIA TECH RES INST16AT & T BELL LAB10WESTERN ELECTRIC CO9AT & T CORP7AT & T TECHNOLOGIES INC6
Top patents by PatentIndex Score
69 records- 0196US4171240AMethod of removing a cured epoxy from a metal surfaceWESTERN ELECTRIC CO·Filed 1978·Granted Oct 16, 1979·81 cites·10 claims
- 0295US6544651B2High dielectric constant nano-structure polymer-ceramic compositeGEORGIA TECH RES INST·Filed 2001·Granted Apr 8, 2003·68 cites·29 claims
- 0394US8278191B2Methods and systems for metal-assisted chemical etching of substratesHILDRETH OWEN·Filed 2010·Granted Oct 2, 2012·50 cites·20 claims
- 0494US6180696B1No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactantGEORGIA TECH RES INST·Filed 1998·Granted Jan 30, 2001·162 cites·15 claims
- 0594US5266352ADevices featuring silicone elastomersAT & T BELL LAB·Filed 1992·Granted Nov 30, 1993·63 cites·6 claims
- 0693US8702897B2Structures including carbon nanotubes, methods of making structures, and methods of using structuresLIN WEI·Filed 2010·Granted Apr 22, 2014·15 cites·12 claims
- 0792US6746896B1Process and material for low-cost flip-chip solder interconnect structuresGEORGIA TECH RES INST·Filed 2000·Granted Jun 8, 2004·58 cites·28 claims
- 0889US11845663B2Method for integrally forming graphene film (GF) of high specific surface area (SSA) by ultrafast ultraviolet (UV) laser processingUNIV GUANGDONG TECHNOLOGY·Filed 2022·Granted Dec 19, 2023·1 cites·6 claims
- 0989US6864306B2High dielectric polymer composites and methods of preparation thereofGEORGIA TECH RES INST·Filed 2002·Granted Mar 8, 2005·27 cites·27 claims
- 1087US6740192B1Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethaneGEORGIA TECH RES INST·Filed 2000·Granted May 25, 2004·28 cites·6 claims
- 1187US5051275ASilicone resin electronic device encapsulantAT & T BELL LAB·Filed 1989·Granted Sep 24, 1991·68 cites·7 claims
- 1286US4271425AEncapsulated electronic devices and encapsulating compositions having crown ethersWESTERN ELECTRIC CO·Filed 1979·Granted Jun 2, 1981·26 cites·7 claims
- 1384US6172141B1Reworkable epoxy underfill encapsulantsGEORGIA TECH RES INST·Filed 1999·Granted Jan 9, 2001·39 cites·21 claims
- 1483US7722951B2Insulator coating and method for forming sameGEORGIA TECH RES INST·Filed 2004·Granted May 25, 2010·26 cites·43 claims
- 1583US7527749B2Electrically conductive adhesives and methods of makingGEORGIA TECH RES INST·Filed 2005·Granted May 5, 2009·5 cites·9 claims
- 1680US4318939AStabilized catalyzed organopolysiloxanesWESTERN ELECTRIC CO·Filed 1980·Granted Mar 9, 1982·24 cites·18 claims
- 1779US7663381B2Electrical condition monitoring method for polymersWATKINS JR KENNETH S·Filed 2008·Granted Feb 16, 2010·8 cites·17 claims
- 1878US6570029B2No-flow reworkable epoxy underfills for flip-chip applicationsGEORGIA TECH RES INST·Filed 2001·Granted May 27, 2003·26 cites·28 claims
- 1976US5217811ADevices featuring silicone elastomersAT & T BELL LAB·Filed 1992·Granted Jun 8, 1993·20 cites·2 claims
- 2075US4200668AMethod of repairing a defective photomaskWESTERN ELECTRIC CO·Filed 1978·Granted Apr 29, 1980·27 cites·30 claims
- 2174US7414416B2Electrical condition monitoring method for polymersPOLYMER AGING CONCEPTS INC·Filed 2003·Granted Aug 19, 2008·14 cites·45 claims
- 2273US8173525B2Systems and methods for nanomaterial transferGRAHAM JR SAMUEL·Filed 2006·Granted May 8, 2012·5 cites·25 claims
- 2373US4508758AEncapsulated electronic circuitAT & T TECHNOLOGIES INC·Filed 1982·Granted Apr 2, 1985·24 cites·8 claims
- 2469US10134634B2Metal-assisted chemical etching of a semiconductive substrate with high aspect ratio, high geometic uniformity, and controlled 3D profilesGEORGIA TECH RES INST·Filed 2015·Granted Nov 20, 2018·3 cites·20 claims
- 2569US5439849AEncapsulation techniques which include forming a thin glass layer onto a polymer layerAT & T CORP·Filed 1994·Granted Aug 8, 1995·40 cites·6 claims
- 2668US6380322B1Reworkable high temperature adhesivesGEORGIA TECH RES INST·Filed 1999·Granted Apr 30, 2002·24 cites·46 claims
- 2767US5215801ASilicone resin electronic device encapsulantAT & T BELL LAB·Filed 1991·Granted Jun 1, 1993·37 cites·8 claims
- 2867US5213864ASilicone encapsulantAT & T BELL LAB·Filed 1991·Granted May 25, 1993·36 cites·8 claims
- 2965US4278784AEncapsulated electronic devices and encapsulating compositionsWESTERN ELECTRIC CO·Filed 1980·Granted Jul 14, 1981·23 cites·10 claims
- 3064US6989433B2Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulationGEORGIA TECH RES INST·Filed 2002·Granted Jan 24, 2006·6 cites·10 claims
- 3164US6498260B2Thermally degradable epoxy underfills for flip-chip applicationsGEORGIA TECH RES INST·Filed 2001·Granted Dec 24, 2002·12 cites·26 claims
- 3264US4888226ASilicone gel electronic device encapsulantAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Dec 19, 1989·33 cites·7 claims
- 3364US4330637AEncapsulated electronic devices and encapsulating compositionsWESTERN ELECTRIC CO·Filed 1981·Granted May 18, 1982·12 cites·29 claims
- 3463US4564562ASilicone encapsulated devicesAT & T TECHNOLOGIES INC·Filed 1984·Granted Jan 14, 1986·22 cites·10 claims
- 3561US4604144AProcess for cleaning a circuit boardAT & T TECHNOLOGIES INC·Filed 1985·Granted Aug 5, 1986·11 cites·10 claims
- 3659US8206776B2Insulator coating for reducing power line system pollution problemsLI JUN·Filed 2010·Granted Jun 26, 2012·1 cites·6 claims
- 3756US2025309153A1Apparatus and Method for Mitigating Crosstalk in an Advanced PackageCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 3855US10850304B2Method and device for processing microstructure arrays of polystyrene-graphene nanocompositesUNIV GUANGDONG TECHNOLOGY·Filed 2019·Granted Dec 1, 2020·0 cites·1 claims
- 3954US4720431ASilicone encapsulated devicesAMERICAN TELEPHONE & TELEGRAPH·Filed 1986·Granted Jan 19, 1988·19 cites·8 claims
- 4053US5348913AMethods for encapsulating electronic devicesAT & T BELL LAB·Filed 1993·Granted Sep 20, 1994·22 cites·15 claims
- 4153US5165956AMethod of encapsulating an electronic device with a silicone encapsulantAT & T BELL LAB·Filed 1991·Granted Nov 24, 1992·17 cites·5 claims
- 4252US7189795B2Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesivesBURGOYNE JR WILLIAM FRANKLIN·Filed 2003·Granted Mar 13, 2007·6 cites·29 claims
- 4352US5275841AMethod for encapsulating integrated circuitAT & T BELL LAB·Filed 1992·Granted Jan 4, 1994·16 cites·8 claims
- 4451US9490043B2Highly conductive electrically conductive adhesivesZHANG RONGWEI·Filed 2012·Granted Nov 8, 2016·0 cites·19 claims
- 4550US5568684AMethod of encapsulating an electronic deviceLUCENT TECHNOLOGIES INC·Filed 1994·Granted Oct 29, 1996·15 cites·2 claims
- 4650US5317196AEncapsulant method and apparatusAT & T BELL LAB·Filed 1992·Granted May 31, 1994·15 cites·7 claims
- 4749US4665148AStabilized silicone gelsAT & T TECHNOLOGIES INC·Filed 1985·Granted May 12, 1987·6 cites·4 claims
- 4848US5438112AMethod for curing silicone resinsAT & T CORP·Filed 1994·Granted Aug 1, 1995·8 cites·17 claims
- 4948US4396796AEncapsulated electronic devices and encapsulating compositionsWESTERN ELECTRIC CO·Filed 1980·Granted Aug 2, 1983·8 cites·36 claims
- 5046US4592959ASilicone encapsulated devicesAT & T TECHNOLOGIES INC·Filed 1984·Granted Jun 3, 1986·7 cites·10 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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