Inventor · disambiguated record

Chee Chong Wong

Also filed as: WONG CHEE C · WONG CHEE CHONG

2 granted patents·53 citations·filing 1993–2001

65Inventor score

Technology areasH05K H10W

Files withAT & T BELL LAB1 INST OF MICROELECTRONICS1

Top patents by PatentIndex Score

2 records

0169US6759319B2Residue-free solder bumping processINST OF MICROELECTRONICS·Filed 2001·Granted Jul 6, 2004·23 cites·17 claims
0264US5307983AMethod of making an article comprising solder bump bondingAT & T BELL LAB·Filed 1993·Granted May 3, 1994·30 cites·8 claims

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Chee Chong Wong — Patent Inventor | PatentIndex