Inventor · disambiguated record
Christy Mei-Chu Woo
Also filed as: WOO CHRISTY · WOO CHRISTY M · WOO CHRISTY M-C · WOO CHRISTY MEI-CHU
96 granted patents·2 pending applications·3,002 citations·filing 1996–2007
99Inventor score
Files withADVANCED MICRO DEVICES INC92ADVANCE MICRO DEVICES INC1ADVANCED MICRO DEVICES INS1AMD1SPANSION LLC1
Top patents by PatentIndex Score
98 records- 0197US6509267B1Method of forming low resistance barrier on low k interconnect with electrolessly plated copper seed layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 21, 2003·156 cites·11 claims
- 0295US6562718B1Process for forming fully silicided gatesADVANCED MICRO DEVICES INC·Filed 2000·Granted May 13, 2003·107 cites·18 claims
- 0394US6346479B1Method of manufacturing a semiconductor device having copper interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 12, 2002·85 cites·17 claims
- 0493US6979625B1Copper interconnects with metal capping layer and selective copper alloysADVANCED MICRO DEVICES INC·Filed 2003·Granted Dec 27, 2005·68 cites·17 claims
- 0593US6830998B1Gate dielectric quality for replacement metal gate transistorsADVANCED MICRO DEVICES INC·Filed 2003·Granted Dec 14, 2004·75 cites·9 claims
- 0693US6727560B1Engineered metal gate electrodeADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 27, 2004·64 cites·9 claims
- 0793US6723635B1Protection low-k ILD during damascene processing with thin linerADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 20, 2004·65 cites·15 claims
- 0892US6228759B1Method of forming an alloy precipitate to surround interconnect to minimize electromigrationADVANCED MICRO DEVICES INC·Filed 2000·Granted May 8, 2001·69 cites·14 claims
- 0992US6103085AElectroplating uniformity by diffuser designADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 15, 2000·134 cites·18 claims
- 1092US5816891APerforming chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughputADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 6, 1998·109 cites·20 claims
- 1191US6713392B1Nitrogen oxide plasma treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 30, 2004·51 cites·15 claims
- 1291US6657304B1Conformal barrier liner in an integrated circuit interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 2, 2003·45 cites·6 claims
- 1391US5916855AChemical-mechanical polishing slurry formulation and method for tungsten and titanium thin filmsADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 29, 1999·110 cites·53 claims
- 1489US6952052B1Cu interconnects with composite barrier layers for wafer-to-wafer uniformityADVANCED MICRO DEVICES INC·Filed 2004·Granted Oct 4, 2005·51 cites·11 claims
- 1589US6586842B1Dual damascene integration scheme for preventing copper contamination of dielectric layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 1, 2003·48 cites·11 claims
- 1689US6555453B1Fully nickel silicided metal gate with shallow junction formedADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 29, 2003·47 cites·18 claims
- 1789US6548395B1Method of promoting void free copper interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 15, 2003·52 cites·20 claims
- 1889US6451693B1Double silicide formation in polysicon gate without silicide in source/drain extensionsADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 17, 2002·48 cites·18 claims
- 1988US6506668B1Utilization of annealing enhanced or repaired seed layer to improve copper interconnect reliabilityADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 14, 2003·58 cites·19 claims
- 2087US6989604B1Conformal barrier liner in an integrated circuit interconnectADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 24, 2006·31 cites·14 claims
- 2187US6525428B1Graded low-k middle-etch stop layer for dual-inlaid patterningADVANCE MICRO DEVICES INC·Filed 2002·Granted Feb 25, 2003·46 cites·17 claims
- 2287US6525425B1Copper interconnects with improved electromigration resistance and low resistivityADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 25, 2003·37 cites·23 claims
- 2387US6433402B1Selective copper alloy depositionADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 13, 2002·47 cites·6 claims
- 2486US7033888B2Engineered metal gate electrodeADVANCED MICRO DEVICES INC·Filed 2004·Granted Apr 25, 2006·33 cites·11 claims
- 2586US6531777B1Barrier metal integrity testing using a dual level line to line leakage testing pattern and partial CMPADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 11, 2003·36 cites·20 claims
- 2686US6387806B1Filling an interconnect opening with different types of alloys to enhance interconnect reliabilityADVANCED MICRO DEVICES INC·Filed 2000·Granted May 14, 2002·47 cites·16 claims
- 2785US7060571B1Semiconductor device with metal gate and high-k tantalum oxide or tantalum oxynitride gate dielectricADVANCED MICRO DEVICES INC·Filed 2004·Granted Jun 13, 2006·35 cites·18 claims
- 2885US6555461B1Method of forming low resistance barrier on low k interconnectADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 29, 2003·40 cites·11 claims
- 2985US6483154B1Nitrogen oxide plasma treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 19, 2002·32 cites·7 claims
- 3084US7755194B1Composite barrier layers with controlled copper interface surface roughnessADVANCED MICRO DEVICES INC·Filed 2006·Granted Jul 13, 2010·10 cites·10 claims
- 3184US7071086B2Method of forming a metal gate structure with tuning of work function by silicon incorporationADVANCED MICRO DEVICES INC·Filed 2003·Granted Jul 4, 2006·32 cites·14 claims
- 3284US6836017B2Protection of low-k ILD during damascene processing with thin linerADVANCED MICRO DEVICES INC·Filed 2004·Granted Dec 28, 2004·30 cites·9 claims
- 3384US6633083B2Barrier layer integrity testADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 14, 2003·33 cites·20 claims
- 3484US6143656ASlurry for chemical mechanical polishing of copperADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 7, 2000·67 cites·12 claims
- 3583US6861350B1Method of manufacturing semiconductor device comprising silicon-rich tasin metal gate electrodeADVANCED MICRO DEVICES INC·Filed 2003·Granted Mar 1, 2005·32 cites·20 claims
- 3682US6495460B1Dual layer silicide formation using a titanium barrier to reduce surface roughness at silicide/junction interfaceADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 17, 2002·30 cites·19 claims
- 3782US6432817B1Tungsten silicide barrier for nickel silicidation of a gate electrodeADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 13, 2002·29 cites·19 claims
- 3881US7994047B1Integrated circuit contact systemSPANSION LLC·Filed 2005·Granted Aug 9, 2011·8 cites·10 claims
- 3981US7071564B1Composite tantalum capped inlaid copper with reduced electromigration and reduced stress migrationADVANCED MICRO DEVICES INC·Filed 2004·Granted Jul 4, 2006·29 cites·25 claims
- 4081US6663787B1Use of ta/tan for preventing copper contamination of low-k dielectric layersADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 16, 2003·32 cites·9 claims
- 4180US6521529B1HDP treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 18, 2003·27 cites·19 claims
- 4280US6440289B1Method for improving seed layer electroplating for semiconductorADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 27, 2002·58 cites·9 claims
- 4380US6096648ACopper/low dielectric interconnect formation with reduced electromigrationAMD·Filed 1999·Granted Aug 1, 2000·59 cites·18 claims
- 4479US6468900B1Dual layer nickel deposition using a cobalt barrier to reduce surface roughness at silicide/junction interfaceADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 22, 2002·25 cites·18 claims
- 4578US6724051B1Nickel silicide process using non-reactive spacerADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 20, 2004·24 cites·7 claims
- 4678US6586333B1Integrated plasma treatment and nickel deposition and tool for performing sameADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 1, 2003·20 cites·13 claims
- 4777US6727592B1Copper interconnect with improved barrier layerADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 27, 2004·23 cites·16 claims
- 4877US6117770AMethod for implanting semiconductor conductive layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 12, 2000·52 cites·20 claims
- 4975US6383880B1NH3/N2-plasma treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·20 cites·17 claims
- 5074US6590288B1Selective deposition in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 8, 2003·16 cites·9 claims
Showing the top 50 of 98 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →