Inventor · disambiguated record
Chien-Ying Wu
Also filed as: WU CHIEN-YING
20 granted patents·8 pending applications·8 citations·filing 2013–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD28
Top patents by PatentIndex Score
28 records- 0194US11940659B2Optical integrated circuit structure including edge coupling protective features and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·2 cites·20 claims
- 0293US11892678B2Photonic device and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 0390US11175452B1Photonic device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
- 0489US11327228B2Photonic device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 0583US12353034B2Optical integrated circuit structure including edge coupling protective features and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0682US2025306309A1Optical integrated circuit structure including edge coupling protective features and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0781US2025110283A1Optical coupling systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0881US2025085476A1Photonic device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0980US12169308B2Method of using fiber to chip coupler and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 1079US12153255B2Method of making photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 1179US12050348B2Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1278US2024361532A1Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1377US2022384503A1Infrared image sensor component manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1476US2023358959A1Photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1576US2024393531A1Photonic Device on a Semiconductor-on-Insulator Substrate and Method of Manufacturing ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1674US11848390B2Capping structures for germanium-containing photovoltaic components and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1774US11740409B2Photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 1872US12072534B2Fiber to chip coupler and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 1972US11892681B2Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 2069US12222542B2Photonic device on a semiconductor-on-insulator substrate and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·20 claims
- 2166US11532759B2Capping structures for germanium-containing photovoltaic components and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 2265US11476288B2Infrared image sensor component manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 18, 2022·0 cites·20 claims
- 2361US9871067B2Infrared image sensor componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·16 claims
- 2460US10453881B2Infrared image sensor componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 2551US2025314917A1Semiconductor photonics devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2650US10050103B2Method of forming semiconductor structures including metal insulator metal capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·0 cites·20 claims
- 2750US9666660B2Semiconductor structures including metal insulator metal capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 30, 2017·0 cites·20 claims
- 2849US11442230B2Silicon photonics coupling structure using an etch stop layer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Chien-Ying Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →