Inventor · disambiguated record
Chengtar Wu
Also filed as: WU CHENGTAR
37 granted patents·14 pending applications·13 citations·filing 2018–2024
94Inventor score
Top patents by PatentIndex Score
51 records- 0186US11228089B2Antenna packaging module and making method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Jan 18, 2022·2 cites·18 claims
- 0285US11316252B2Antenna packaging structure and method for forming the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 26, 2022·2 cites·16 claims
- 0382US11211687B2Method of fabricating a semiconductor structure with an antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Dec 28, 2021·3 cites·5 claims
- 0475US10714435B2Fan-out antenna packaging structure and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jul 14, 2020·2 cites·11 claims
- 0574US10777876B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 15, 2020·1 cites·4 claims
- 0673US10325786B1Double-sided plastic fan-out package structure having antenna and manufacturing method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jun 18, 2019·2 cites·9 claims
- 0770US11502392B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Nov 15, 2022·0 cites·9 claims
- 0868US11437707B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Sep 6, 2022·0 cites·5 claims
- 0968US10770394B2Fan-out semiconductor packaging structure with antenna module and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Sep 8, 2020·1 cites·15 claims
- 1067US11699840B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 1164US11728558B2Semiconductor structure including antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Aug 15, 2023·0 cites·9 claims
- 1263US11488915B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Nov 1, 2022·0 cites·8 claims
- 1361US11283152B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Mar 22, 2022·0 cites·9 claims
- 1461US2025062260A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1560US11302658B2Fan-out antenna package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 12, 2022·0 cites·10 claims
- 1660US11289435B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Mar 29, 2022·0 cites·16 claims
- 1760US10886594B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 1860US2024395781A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1960US2024404921A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2060US2025046721A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2160US2024379635A13d integrated circuit (3dic) structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2260US2024421123A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2360US2025022860A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2459US11257772B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Feb 22, 2022·0 cites·9 claims
- 2559US2024355794A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2659US2024258222A13d integrated circuit (3dic) structures and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2759US2024258221A13d integrated circuit (3dic) structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2859US2024355802A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2959US2024339411A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3058US2024321851A1Semiconductor packages and method for manufacturing the sameSAMSUNG ELECTERONICS CO LTD·Filed 2023·Application pending·0 cites
- 3157US10886243B2Fan-out antenna packaging structure and preparation thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·5 claims
- 3254US11114391B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 7, 2021·0 cites·9 claims
- 3354US10804229B2Fan-out antenna package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Oct 13, 2020·0 cites·7 claims
- 3454US10573609B2Fan-out antenna packaging structure and preparation thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Feb 25, 2020·0 cites·6 claims
- 3553US11228087B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 18, 2022·0 cites·10 claims
- 3653US10854951B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Dec 1, 2020·0 cites·11 claims
- 3753US10777516B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 15, 2020·0 cites·7 claims
- 3852US11322852B2Lens antenna packaging structure, preparation method and electronic deviceSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted May 3, 2022·0 cites·16 claims
- 3951US10777515B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Sep 15, 2020·0 cites·9 claims
- 4050US11289793B2Semiconductor packaging structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Mar 29, 2022·0 cites·11 claims
- 4150US10854476B2Semiconductor vertical wire bonding structure and methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Dec 1, 2020·0 cites·14 claims
- 4249US11735564B2Three-dimensional chip packaging structure and method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Aug 22, 2023·0 cites·7 claims
- 4348US2021202338A1Wafer-level sip module structure and method for preparing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Application pending·0 cites
- 4447US11462403B2Semiconductor structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Oct 4, 2022·0 cites·6 claims
- 4545US11626657B2Antenna packaging module and making method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 4643US11316247B2Semiconductor packaging structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Apr 26, 2022·0 cites·8 claims
- 4743US11133568B2Semiconductor package structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Sep 28, 2021·0 cites·11 claims
- 4842US11515269B2Semiconductor packaging structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Nov 29, 2022·0 cites·13 claims
- 4942US10916829B2Semiconductor package structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Feb 9, 2021·0 cites·9 claims
- 5039US10872867B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Dec 22, 2020·0 cites·5 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →