Inventor · disambiguated record
Chunyong Wu
Also filed as: WU CHUNYONG
2 granted patents·2 pending applications·0 citations·filing 2021–2023
23Inventor score
Files withHENKEL AG & CO KGAA4
Top patents by PatentIndex Score
4 records- 0168US2023391986A1One component thermally conductive ambient temperature curable materialsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0265US12441881B2Thermal interface materialsHENKEL AG & CO KGAA·Filed 2021·Granted Oct 14, 2025·0 cites·15 claims
- 0360US12460065B2Thermal interface materials based on two-part polyurethanesHENKEL AG & CO KGAA·Filed 2021·Granted Nov 4, 2025·0 cites·21 claims
- 0455US2024279426A1Non-silicone thermal interface materialHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chunyong Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →