Inventor · disambiguated record
Chong-Wei Wu
Also filed as: WU CHONG-WEI
1 granted patent·2 pending applications·0 citations·filing 2011–2021
8Inventor score
Top patents by PatentIndex Score
3 records- 0142US2022129039A1Electronic device housings with shock absorbersHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 0240US2023135341A1Support brackets with multiple orientationsHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 0324US8245387B2Disassembling deviceWU CHONG-WEI·Filed 2011·Granted Aug 21, 2012·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →