Inventor · disambiguated record
Chung-Lin Wu
Also filed as: WU CHUNG-LIN
52 granted patents·8 pending applications·1,102 citations·filing 1995–2025
98Inventor score
Files withFAIRCHILD SEMICONDUCTOR29SEMICONDUCTOR COMPONENTS IND LLC5IND TECH RES INST4JEON OSEOB3WU CHUNG-LIN3
Top patents by PatentIndex Score
60 records- 0198US7081666B2Lead frame structure with aperture or groove for flip chip in a leaded molded packageFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Jul 25, 2006·92 cites·17 claims
- 0298US6891256B2Thin, thermally enhanced flip chip in a leaded molded packageFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted May 10, 2005·167 cites·20 claims
- 0398US6683375B2Semiconductor die including conductive columnsFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted Jan 27, 2004·149 cites·9 claims
- 0497US7332806B2Thin, thermally enhanced molded package with leadframe having protruding regionFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Feb 19, 2008·48 cites·13 claims
- 0596US7022548B2Method for making a semiconductor die packageFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Apr 4, 2006·92 cites·13 claims
- 0696US6867481B2Lead frame structure with aperture or groove for flip chip in a leaded molded packageFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Mar 15, 2005·105 cites·7 claims
- 0795US6836023B2Structure of integrated trace of chip packageFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Dec 28, 2004·110 cites·20 claims
- 0894US8183088B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2010·Granted May 22, 2012·22 cites·14 claims
- 0994US7772681B2Semiconductor die package and method for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Aug 10, 2010·25 cites·10 claims
- 1092US9735112B2Isolation between semiconductor componentsFAIRCHILD SEMICONDUCTOR·Filed 2015·Granted Aug 15, 2017·13 cites·20 claims
- 1192US9347838B2Capacitive shear force sensor and method for fabricating thereofIND TECH RES INST·Filed 2013·Granted May 24, 2016·23 cites·53 claims
- 1291US7468548B2Thermal enhanced upper and dual heat sink exposed molded leadless packageFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Dec 23, 2008·16 cites·15 claims
- 1388US7154186B2Multi-flip chip on lead frame on over molded IC package and method of assemblyFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Dec 26, 2006·42 cites·13 claims
- 1487US8664752B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2012·Granted Mar 4, 2014·9 cites·10 claims
- 1586US9536800B2Packaged semiconductor devices and methods of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2014·Granted Jan 3, 2017·8 cites·20 claims
- 1686US8193043B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameJEON OSEOB·Filed 2010·Granted Jun 5, 2012·9 cites·18 claims
- 1785US9177925B2Apparatus related to an improved package including a semiconductor dieFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Nov 3, 2015·7 cites·29 claims
- 1884US7968982B2Thermal enhanced upper and dual heat sink exposed molded leadless packageFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 28, 2011·9 cites·16 claims
- 1984US7635635B2Method for bonding a semiconductor substrate to a metal substrateFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Dec 22, 2009·9 cites·22 claims
- 2083US8487371B2Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the sameKINZER DANIEL M·Filed 2011·Granted Jul 16, 2013·7 cites·16 claims
- 2182US7800219B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Sep 21, 2010·10 cites·9 claims
- 2282US7335532B2Method of assembly for multi-flip chip on lead frame on overmolded IC packageFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Feb 26, 2008·9 cites·2 claims
- 2381US8723300B2Multi-chip module power clipWU CHUNG-LIN·Filed 2012·Granted May 13, 2014·7 cites·21 claims
- 2480US10446498B2Isolation between semiconductor componentsFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Oct 15, 2019·3 cites·18 claims
- 2580US7821124B2Thin, thermally enhanced flip chip in a leaded molded packageFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Oct 26, 2010·6 cites·20 claims
- 2679US8706952B2Flash memory storage device, controller thereof, and data programming method thereofHSU CHIH-JEN·Filed 2010·Granted Apr 22, 2014·7 cites·22 claims
- 2779US8058732B2Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2008·Granted Nov 15, 2011·10 cites·33 claims
- 2877US5645668AMethod of forming composite articles using a mandrel assemblyIND TECH RES INST·Filed 1995·Granted Jul 8, 1997·33 cites·11 claims
- 2976US7525179B2Lead frame structure with aperture or groove for flip chip in a leaded molded packageFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Apr 28, 2009·5 cites·18 claims
- 3074US9478519B2Package including a semiconductor die and a capacitive componentFAIRCHILD SEMICONDUCTOR·Filed 2015·Granted Oct 25, 2016·2 cites·19 claims
- 3174US8278742B2Thermal enhanced upper and dual heat sink exposed molded leadless package and methodWU CHUNG-LIN·Filed 2011·Granted Oct 2, 2012·3 cites·4 claims
- 3274US2025233055A1Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 3373US7960800B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 14, 2011·5 cites·13 claims
- 3472US11735508B2Vertical and horizontal circuit assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 3572US8598035B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 3669US8806301B2Data writing method for a flash memory, and controller and storage system using the sameYU HSIANG-HSIUNG·Filed 2009·Granted Aug 12, 2014·5 cites·13 claims
- 3769US7845214B2Device and method for optical nanoindentation measurementIND TECH RES INST·Filed 2008·Granted Dec 7, 2010·4 cites·22 claims
- 3865US12278169B2Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 3965US8578245B2Data reading method, memory storage apparatus, and controller thereofYEH CHIH-KANG·Filed 2011·Granted Nov 5, 2013·3 cites·19 claims
- 4065US8230162B2Block management method for flash memory, and flash memory controller and flash memory storage device using the sameYU HSIANG-HSIUNG·Filed 2010·Granted Jul 24, 2012·2 cites·25 claims
- 4159US11177203B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 4258US11296069B2Substrate interposer on a leaderframeFAIRCHILD SEMICONDUCTOR·Filed 2020·Granted Apr 5, 2022·0 cites·16 claims
- 4355US10256178B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
- 4454US10943855B2Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 9, 2021·0 cites·13 claims
- 4554US9159656B2Semiconductor die package and method for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 4651US11004777B2Semiconductor device assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted May 11, 2021·0 cites·22 claims
- 4751US5580416AMandrel assemblyIND TECH RES INST·Filed 1995·Granted Dec 3, 1996·12 cites·22 claims
- 4850US2025295038A1Method for producing ferroelectric thin films using a substrate with a polarization fieldUNIV NAT CHENG KUNG·Filed 2024·Application pending·0 cites
- 4949US8866218B2Wafer level MOSFET metallizationFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Oct 21, 2014·0 cites·21 claims
- 5046US10546847B2Substrate interposer on a leadframeFAIRCHILD SEMICONDUCTOR·Filed 2016·Granted Jan 28, 2020·0 cites·22 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →