Inventor · disambiguated record
Chengwei Wu
Also filed as: WU CHENGWEI
8 granted patents·1 pending application·12 citations·filing 2016–2022
80Inventor score
Top patents by PatentIndex Score
9 records- 0182US10541217B2Semiconductor packageWU CHENGWEI·Filed 2018·Granted Jan 21, 2020·3 cites·18 claims
- 0281US11658137B2Semiconductor packageWU CHENGWEI·Filed 2021·Granted May 23, 2023·1 cites·18 claims
- 0379US10957662B2Semiconductor packageWU CHENGWEI·Filed 2019·Granted Mar 23, 2021·2 cites·18 claims
- 0479US9679872B1Connection structure for semiconductor package having plural vias located within projection of conductive unitWU CHENGWEI·Filed 2016·Granted Jun 13, 2017·4 cites·18 claims
- 0574US2023106826A1Semiconductor PackageWU CHENGWEI·Filed 2022·Application pending·0 cites
- 0668US11738185B2In-plane metal microneedle array and manufacturing method thereforUNIV DALIAN TECH·Filed 2019·Granted Aug 29, 2023·2 cites·4 claims
- 0754US10283467B2Semiconductor packageWU CHENGWEI·Filed 2017·Granted May 7, 2019·0 cites·17 claims
- 0841US11860187B2Modified method to fit cell elastic modulus based on Sneddon modelUNIV DALIAN TECH·Filed 2020·Granted Jan 2, 2024·0 cites·1 claims
- 0939US11951271B2Method of manufacturing an in-plane metal microneedle arrayUNIV DALIAN TECH·Filed 2019·Granted Apr 9, 2024·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →