Inventor · disambiguated record
Chih-Wei Wu
Also filed as: WU CHIH WEI J · WU CHIH-WEI
120 granted patents·54 pending applications·485 citations·filing 2003–2025
99Inventor score
Top patents by PatentIndex Score
174 records- 0198US11824040B2Package component, electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·5 cites·20 claims
- 0298US11482497B2Package structure including a first die and a second die and a bridge die and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·7 cites·20 claims
- 0398US10867965B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·23 cites·20 claims
- 0498US10529690B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·35 cites·20 claims
- 0597US12033978B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·2 cites·20 claims
- 0697US12033949B2Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·3 cites·20 claims
- 0797US11456245B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0897US11296032B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·5 cites·20 claims
- 0997US10529637B1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·17 cites·20 claims
- 1097US9570421B2Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·27 cites·20 claims
- 1197US9368458B2Die-on-interposer assembly with dam structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·25 cites·18 claims
- 1296US11990351B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·3 cites·20 claims
- 1396US10861799B1Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·12 cites·20 claims
- 1496US8518753B2Assembly method for three dimensional integrated circuitWU CHIH-WEI·Filed 2011·Granted Aug 27, 2013·28 cites·20 claims
- 1595US11289424B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·11 cites·20 claims
- 1695US9704825B2Chip packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·11 cites·20 claims
- 1795US8580683B2Apparatus and methods for molding die on wafer interposersWANG CHUNG YU·Filed 2011·Granted Nov 12, 2013·20 cites·16 claims
- 1894US12230605B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·1 cites·20 claims
- 1994US11410897B2Semiconductor structure having a dielectric layer edge covering circuit carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 9, 2022·7 cites·20 claims
- 2094US10510684B2Three dimensional integrated circuit (3DIC) with support structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·8 cites·20 claims
- 2193US12272568B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·1 cites·20 claims
- 2293US11810831B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·1 cites·20 claims
- 2393US9337096B2Apparatus and methods for molding die on wafer interposersTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 10, 2016·12 cites·20 claims
- 2492US10804178B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·5 cites·20 claims
- 2592US10756058B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·5 cites·18 claims
- 2692US10269589B2Method of manufacturing a release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 2792US10115650B2Die-on-interposer assembly with dam structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·5 cites·20 claims
- 2892US8749077B2Three-dimensional integrated circuit (3DIC)TAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 10, 2014·10 cites·23 claims
- 2991US12183681B2Package structure having bridge structure for connection between semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 31, 2024·2 cites·20 claims
- 3091US11600595B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·2 cites·20 claims
- 3191US10916450B2Package of integrated circuits having a light-to-heat-conversion coating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·6 cites·19 claims
- 3291US8557684B2Three-dimensional integrated circuit (3DIC) formation processWU CHIH-WEI·Filed 2011·Granted Oct 15, 2013·10 cites·11 claims
- 3391US7474527B2Desktop personal computer and thermal module thereofDFI INC·Filed 2007·Granted Jan 6, 2009·27 cites·12 claims
- 3490US11749607B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·1 cites·20 claims
- 3590US11502056B2Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 3690US9768227B2Light-emitting element having a plurality of light-emitting structuresEPISTAR CORP·Filed 2014·Granted Sep 19, 2017·8 cites·17 claims
- 3789US11164855B2Package structure with a heat dissipating element and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·6 cites·20 claims
- 3889US11145562B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 3989US8501590B2Apparatus and methods for dicing interposer assemblyWANG CHUNG YU·Filed 2011·Granted Aug 6, 2013·8 cites·16 claims
- 4088US9929109B2Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·4 cites·20 claims
- 4186US11817111B2Perceptually-based loss functions for audio encoding and decoding based on machine learningDOLBY LABORATORIES LICENSING CORP·Filed 2019·Granted Nov 14, 2023·6 cites·19 claims
- 4286US11694975B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·1 cites·20 claims
- 4385US12368132B2Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 4485US10510732B2PoP device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 4585US2025309188A1Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4684US11515267B2Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 4782US8541883B2Semiconductor device having shielded conductive viasCHENG HUNG-HSIANG·Filed 2011·Granted Sep 24, 2013·8 cites·14 claims
- 4882US2024234372A1Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4982US2024387197A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5081US10930701B2Light-emitting element having a plurality of light-emitting structuresEPISTAR CORP·Filed 2019·Granted Feb 23, 2021·1 cites·12 claims
Showing the top 50 of 174 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →