Inventor · disambiguated record
Chung-Hwa Wu
Also filed as: WU CHUNG-HWA
3 granted patents·4 pending applications·0 citations·filing 2011–2021
38Inventor score
Top patents by PatentIndex Score
7 records- 0148US2014319668A1High thermal performance 3d package on package structureMEDIATEK INC·Filed 2014·Application pending·0 cites
- 0243US2013093073A1High thermal performance 3d package on package structureCHEN TAI-YU·Filed 2012·Application pending·0 cites
- 0342US11295802B2Circuit having a plurality of receivers using the same reference voltageMEDIATEK INC·Filed 2020·Granted Apr 5, 2022·0 cites·9 claims
- 0441US2020051615A1Multi-rank topology of memory module and associated control methodMEDIATEK INC·Filed 2019·Application pending·0 cites
- 0538US11790977B2Transmitter with voltage level adjustment mechanism in memory controllerMEDIATEK INC·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 0637US2018322914A1Multi-rank topology of memory module and associated control methodMEDIATEK INC·Filed 2018·Application pending·0 cites
- 0725US8288863B2Semiconductor package device with a heat dissipation structure and the packaging method thereofYEH CHIA-FENG·Filed 2011·Granted Oct 16, 2012·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Chung-Hwa Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →