Inventor · disambiguated record
Chia-Tien Wu
Also filed as: WU CHIA-TIEN
99 granted patents·44 pending applications·234 citations·filing 1995–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD134WU I LONG2TAIWAY SEMICONDUCTOR MFG COMPANY LTD1TIAWAN SEMICONDUCTOR MFG CO LTD1WU CHIA-TIEN1
Top patents by PatentIndex Score
143 records- 0198US11158580B2Semiconductor devices with backside power distribution network and frontside through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 26, 2021·27 cites·20 claims
- 0297US11729969B1Semiconductor device and method of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·5 cites·20 claims
- 0397US10269715B2Split rail structures located in adjacent metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·29 cites·20 claims
- 0497US10020261B2Split rail structures located in adjacent metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 10, 2018·31 cites·20 claims
- 0596US9418868B1Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·11 cites·20 claims
- 0695US11842967B2Semiconductor devices with backside power distribution network and frontside through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0794US9431297B2Method of forming an interconnect structure for a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·15 cites·20 claims
- 0894US9397045B2Structure and formation method of damascene structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 19, 2016·12 cites·20 claims
- 0991US11004740B2Structure and method for interconnection with self-alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·6 cites·20 claims
- 1091US10475703B2Structure and formation method of damascene structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·5 cites·20 claims
- 1191US9716035B2Combination interconnect structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 25, 2017·11 cites·17 claims
- 1290US9490136B1Method of forming trench cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·8 cites·20 claims
- 1389US10991618B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·4 cites·20 claims
- 1487US12400964B2Integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 1587US12394633B2Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1687US10930551B2Methods for fabricating a low-resistance interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
- 1787US10163654B2Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·3 cites·8 claims
- 1885US11764106B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·1 cites·20 claims
- 1985US9412652B2Air gap forming techniques based on anodic alumina for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 9, 2016·3 cites·20 claims
- 2084US12300623B2Integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 2184US11018157B2Local interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 25, 2021·3 cites·19 claims
- 2284US10957580B2Metal routing with flexible space formed using self-aligned spacer patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 23, 2021·1 cites·20 claims
- 2384US9997404B2Method of forming an interconnect structure for a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·3 cites·20 claims
- 2484US2025329641A1Deep lines and shallow lines in signal conducting pathsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2584US2025259933A1Integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2683US2025316591A1Signal conducting line arrangements in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2782US12283477B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 2882US10529617B2Metal routing with flexible space formed using self-aligned spacer patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·2 cites·20 claims
- 2982US9583383B2Air gap forming techniques based on anodic alumina for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 28, 2017·2 cites·20 claims
- 3081US12278143B2Method of providing a workpiece including low resistance interconnect low-resistance interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 3181US12230534B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 3281US10777452B2Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 15, 2020·3 cites·20 claims
- 3381US9076790B1Air gap forming techniques based on anodic alumina for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 7, 2015·3 cites·20 claims
- 3481US2025218765A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3580US12388016B2Deep lines and shallow lines in signal conducting pathsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 3680US11581298B2Zero mask high density capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·1 cites·20 claims
- 3780US2025343148A1Integrated chip structure with high thermal conductivity layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3879US12125795B2Integrated chip with inter-wire cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 3979US11967560B2Integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·20 claims
- 4079US11894238B2Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 4179US10026647B2Multi-metal fill with self-align patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 17, 2018·2 cites·20 claims
- 4279US2024371779A1Integrated chip with inter-wire cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4379US2024363614A1Zero Mask High Density CapacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4479US2025357346A1Method of manufacturing integrated circuit structure including first metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4579US2025349649A1Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4679US2025349709A1Semiconductor device including structure connecting frontside and backside metal and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4779US2025364402A1Interconnection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4878US12381145B2Signal conducting line arrangements in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 4977US12062652B2Zero mask high density capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 5077US10734275B2Metal routing with flexible space formed using self-aligned spacer patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·1 cites·20 claims
Showing the top 50 of 143 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →