Inventor · disambiguated record
Chin-Yung Wu
Also filed as: WU CHIN-YUNG
2 granted patents·1 pending application·34 citations·filing 1999–2001
55Inventor score
Files withIND TECH RES INST2
Top patents by PatentIndex Score
3 records- 0162US6187613B1Process for underfill encapsulating flip chip driven by pressureIND TECH RES INST·Filed 1999·Granted Feb 13, 2001·34 cites·6 claims
- 0235US2002158367A1Method for preventing gate washout in in-mould decoration processFiled 2001·Application pending·0 cites
- 0326US6315542B1Gas injection mold structure for a gas auxiliary injection molding equipmentIND TECH RES INST·Filed 1999·Granted Nov 13, 2001·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →