Inventor · disambiguated record
Chin-Ta Wu
Also filed as: WU CHIN-TA
8 granted patents·3 pending applications·50 citations·filing 1998–2021
83Inventor score
Top patents by PatentIndex Score
11 records- 0191US11367641B2Wafer storage device, carrier plate and wafer cassettePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jun 21, 2022·6 cites·20 claims
- 0282US10388535B1Wafer processing method with full edge trimmingPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·7 cites·10 claims
- 0366US6869837B1Methods of fabricating a word-line spacer for wide over-etching window on outside diameter (OD) and strong fenceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 22, 2005·11 cites·39 claims
- 0458US7000805B1PU foam rubber fluid applicatorWU CHIN-TA·Filed 2003·Granted Feb 21, 2006·15 cites·3 claims
- 0551US11410945B2Semiconductor package having partial outer metal layer and packaging method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·5 claims
- 0645US11658046B2Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·7 claims
- 0744US2022118631A1Head of a chip pickerPOWERTECH TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 0843US11587808B2Chip carrier devicePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Feb 21, 2023·0 cites·6 claims
- 0941US2021339338A1Laser cutting method for a waferPOWERTECH TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 1040US6037251AProcess for intermetal SOG/SOP dielectric planarizationMOSEL VITELIC INC·Filed 1998·Granted Mar 14, 2000·11 cites·20 claims
- 1133US2019229064A1Laser color marking method for a semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chin-Ta Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →