Inventor · disambiguated record
Chung-Jung Wu
Also filed as: WU CHUNG-JUNG
17 granted patents·8 pending applications·44 citations·filing 2011–2024
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18SENSORTEK TECH CORP3WISTRON CORP2DELL PRODUCTS LP1TSAI MENG-HAN1
Top patents by PatentIndex Score
25 records- 0198US11996351B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·20 cites·20 claims
- 0298US11387164B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·19 cites·20 claims
- 0396US11410910B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0484US12341081B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0580US11901263B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 0677US2024249999A1Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0776US11631629B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 18, 2023·0 cites·20 claims
- 0872US11569147B2Method of forming semiconductor package with composite thermal interface material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0968US9978709B2Solder bump stretching method for forming a solder bump joint in a deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·1 cites·20 claims
- 1067US11699996B2Method for proximity sensing and applied electronic device thereofSENSORTEK TECH CORP·Filed 2021·Granted Jul 11, 2023·0 cites·22 claims
- 1163US9475145B2Solder bump joint in a device including lamellar structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 25, 2016·1 cites·20 claims
- 1262US12445129B2Proximity detection method and circuit thereofSENSORTEK TECH CORP·Filed 2021·Granted Oct 14, 2025·0 cites·22 claims
- 1361US12416951B2Electronic device including a movably connected bezelWISTRON CORP·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 1461US11955405B2Semiconductor package including thermal interface structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 1559US11811398B2Capacitance sensing device operation methodSENSORTEK TECH CORP·Filed 2021·Granted Nov 7, 2023·0 cites·13 claims
- 1658US11107747B2Semiconductor package with composite thermal interface material structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 1757US12500108B2Bonding system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 1856US2024371705A1Wafer bonding apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1956US2024145316A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2055US2025366372A1Wafer formation and processing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2155US2024404962A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2253US2025231592A1Electronic device and hinge module with multimedia assembly thereofWISTRON CORP·Filed 2024·Application pending·0 cites
- 2353US2023420337A1Cooling Cover and Packaged Semiconductor Device Including the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2443US2024330091A1Systems and methods for advanced error reporting using multi-frequency signalingDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 2538US8870403B2Handheld electronic device and flashlight moduleTSAI MENG-HAN·Filed 2011·Granted Oct 28, 2014·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →