Inventor · disambiguated record
Chung Wu
Also filed as: WU CHUNG · WU CHUNG-PAN
7 granted patents·6 pending applications·138 citations·filing 2005–2013
84Inventor score
Top patents by PatentIndex Score
13 records- 0192US7338186B1Assembled structure of large-sized LED lampCHAUN CHOUNG TECHNOLOGY CORP·Filed 2006·Granted Mar 4, 2008·92 cites·8 claims
- 0285US7116552B2Heat-dissipation apparatus of portable computerCHAUN CHOUNG TECHNOLOGY CORP·Filed 2005·Granted Oct 3, 2006·21 cites·17 claims
- 0383US7441593B2Protective cover for heat-conductive material of heat sinkCHAUN CHOUNG TECHNOLOGY CORP·Filed 2005·Granted Oct 28, 2008·15 cites·15 claims
- 0477US7275409B1Method for manufacturing a heat pipe having an enlarged portionCHAUN CHOUNG TECHNOLOGY CORP·Filed 2006·Granted Oct 2, 2007·6 cites·8 claims
- 0558US8242594B2Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structureWU CHUNG-PAN·Filed 2009·Granted Aug 14, 2012·3 cites·17 claims
- 0651US2007253202A1LED lamp and heat-dissipating structure thereofCHAUN CHOUNG TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 0745US2014071656A1Light source module and bulb lampTSENG TZYY-JANG·Filed 2013·Application pending·0 cites
- 0842US2007254519A1Pressing mechanism for LED chipCHAUN CHOUNG TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 0939US8529091B2T-bar lampSUNG YUNG-CHENG·Filed 2012·Granted Sep 10, 2013·0 cites·10 claims
- 1039US2007240868A1Air-guiding structure for heat-dissipating finCHAUN CHOUNG TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 1137US2006255453A1Tightly engaged heat dissipating apparatus and method for manufacturing the sameCHAUN CHOUNG TECHNOLOGY CORP·Filed 2005·Application pending·0 cites
- 1232US2006260787A1Flattened contact cooling moduleCHAUN CHOUNG TECHNOLOGY CORP·Filed 2005·Application pending·0 cites
- 1323USD729961SLighting bulbSUNG YUNG-CHENG·Filed 2013·Granted May 19, 2015·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →