Inventor · disambiguated record
Chen-Hao Wu
Also filed as: WU CHEN HAO
32 granted patents·12 pending applications·42 citations·filing 2008–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD38CHANG KUO-FENG2WU CHEN HAO2JARLLYTEC CO LTD1PEGATRON CORP1
Top patents by PatentIndex Score
44 records- 0191US11004794B2Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·5 cites·20 claims
- 0289US11752592B2Slurry enhancement for polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·1 cites·20 claims
- 0389US11495471B2Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 0489US11267987B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·2 cites·20 claims
- 0589US10714395B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·4 cites·20 claims
- 0686US11120995B2Method for forming multi-layer maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·3 cites·20 claims
- 0785US2025309119A1Partial Barrier Free Vias for Cobalt-Based Interconnects and Methods of Fabrication ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0884US12441912B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0984US8763969B2Foldable display supportWU CHEN HAO·Filed 2012·Granted Jul 1, 2014·21 cites·15 claims
- 1082US2023356356A1Slurry enhancement for polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1181US12362281B2Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 1281US12176217B2Method for manufacturing a semiconductor using slurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1381US11942373B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 26, 2024·0 cites·20 claims
- 1481US11389928B2Method for conditioning polishing padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 19, 2022·1 cites·20 claims
- 1579US12269141B2Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1677US2025235979A1Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1776US12024651B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1876US2025218792A1Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1975US12261055B2Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 2075US11697183B2Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 11, 2023·0 cites·20 claims
- 2174US11688644B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 2273US11776910B2Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 2371US12489082B2Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 2471US10998239B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 4, 2021·0 cites·20 claims
- 2569US11688607B2SlurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·19 claims
- 2669US2025312889A1Chemical mechanical polishing system with polishing pad height measurement sensor systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2768US11525072B2Materials and methods for chemical mechanical polishing of ruthenium-containing materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 2866US11756825B2Semiconductor structure with oxidized rutheniumTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 2961US11004691B2Mechanism for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 3061US10727076B2Slurry and manufacturing semiconductor using the slurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 3161US7841051B2Dual swing hinge structureJARLLYTEC CO LTD·Filed 2008·Granted Nov 30, 2010·3 cites·6 claims
- 3259US10497574B2Method for forming multi-layer maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 3358US10920105B2Materials and methods for chemical mechanical polishing of ruthenium-containing materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 3457US2025316534A1Method for forming semiconductor structure with metal portions made of different materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3556US10510555B2Mechanism for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 3656US2025014943A1Surface Profile Control Of Passivation Layers In Integrated Circuit ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3755US2024112928A1Trimming methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3854US10847410B2Ruthenium-containing semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·0 cites·20 claims
- 3954US2025168297A1Video conference system and video conference methodPEGATRON CORP·Filed 2024·Application pending·0 cites
- 4051US2009158554A1Positioning Device for Hinge StructureCHANG KUO-FENG·Filed 2008·Application pending·0 cites
- 4151US2009065749A1Supporting Structure Capable of Vertically ElevatingWU CHEN HAO·Filed 2008·Application pending·0 cites
- 4248US10269579B1Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·0 cites·20 claims
- 4347US10964549B2Wafer polishing with separated chemical reaction and mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 4444US2009031531A1Arresting Device for Hinge Assembly StructureCHANG KUO-FENG·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →