Inventor · disambiguated record
Chris Wyland
Also filed as: WYLAND CHRIS
9 granted patents·3 pending applications·97 citations·filing 2002–2007
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0185US7217997B2Ground arch for wirebond ball grid arraysNXP BV·Filed 2004·Granted May 15, 2007·47 cites·4 claims
- 0277US8203219B2Electrically enhanced wirebond packageWYLAND CHRIS·Filed 2007·Granted Jun 19, 2012·9 cites·20 claims
- 0375US8399982B2Nanotube-based directionally-conductive adhesiveWYLAND CHRIS·Filed 2005·Granted Mar 19, 2013·8 cites·21 claims
- 0471US6778398B2Thermal-conductive substrate packageKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Aug 17, 2004·19 cites·11 claims
- 0565US8134073B2Method and system for composite bond wiresWYLAND CHRIS·Filed 2007·Granted Mar 13, 2012·4 cites·18 claims
- 0664US7872352B2Carbon nanotube bond pad structure and method thereforTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jan 18, 2011·3 cites·12 claims
- 0763US8681500B2Integrated circuit nanotube-based subsrateWYLAND CHRIS·Filed 2005·Granted Mar 25, 2014·3 cites·24 claims
- 0858US8848372B2Nanotube-based fluid interface material and approachWYLAND CHRIS·Filed 2005·Granted Sep 30, 2014·3 cites·20 claims
- 0955US8237516B2Enhanced substrate using metamaterialsWYLAND CHRIS·Filed 2006·Granted Aug 7, 2012·1 cites·22 claims
- 1036US2006049505A1High density interconnect power and ground strap and method thereforKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Application pending·0 cites
- 1134US2011156255A1Carbon nanotube-based filler for integrated circuitsKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
- 1232US2006125079A1High density package interconnect wire bond strip line and method thereforWYLAND CHRIS·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →