Inventor · disambiguated record
Chengzeng Xu
Also filed as: XU CHENGZENG
10 granted patents·2 pending applications·560 citations·filing 1996–2003
93Inventor score
Top patents by PatentIndex Score
12 records- 0196US6224965B1Microfiber dielectrics which facilitate laser via drillingHONEYWELL INT INC·Filed 1999·Granted May 1, 2001·155 cites·7 claims
- 0292US5850498ALow stress optical waveguide having conformal cladding and fixture for precision optical interconnectsALLIED SIGNAL INC·Filed 1997·Granted Dec 15, 1998·122 cites·40 claims
- 0391US6530147B1Microfiber dielectrics which facilitate laser via drillingHONEYWELL INT INC·Filed 2000·Granted Mar 11, 2003·41 cites·16 claims
- 0489US6335149B1High performance acrylate materials for optical interconnectsCORNING INC·Filed 1997·Granted Jan 1, 2002·72 cites·9 claims
- 0586US6245696B1Lasable bond-ply materials for high density printed wiring boardsHONEYWELL INT INC·Filed 1999·Granted Jun 12, 2001·59 cites·11 claims
- 0681US6673190B2Lasable bond-ply materials for high density printed wiring boardsHONEYWELL INT INC·Filed 2001·Granted Jan 6, 2004·27 cites·9 claims
- 0774US6512874B2High performance acrylate materials for optical interconnectsCORNING INC·Filed 2001·Granted Jan 28, 2003·11 cites·31 claims
- 0873US6255039B1Fabrication of high density multilayer interconnect printed circuit boardsISOLA LAMINATE SYSTEMS CORP·Filed 1998·Granted Jul 3, 2001·38 cites·24 claims
- 0960US6162579ANitrone compounds as photopolymer polymerization inhibitors and contrast enhancing additivesCORNING INC·Filed 1996·Granted Dec 19, 2000·26 cites·5 claims
- 1049US2004170795A1Lasable bond-ply materials for high density printed wiring boardsALLIED SIGNAL INC·Filed 2003·Application pending·0 cites
- 1140US2004016118A1Microfiber dielectrics which facilitate laser via drillingFiled 2002·Application pending·0 cites
- 1232US6168898B1Positive acting photodielectric compositionISOLA LAMINATE SYSTEMS CORP·Filed 1998·Granted Jan 2, 2001·9 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →