Inventor · disambiguated record
Chih-Kai Yang
Also filed as: YANG CHIH-KAI
77 granted patents·44 pending applications·517 citations·filing 2005–2025
99Inventor score
Files withINVENTEC CORP31INVENTEC PUDONG TECH CORP26TAIWAN SEMICONDUCTOR MFG CO LTD23MACRONIX INT CO LTD9FOXCONN INTERCONNECT TECHNOLOGY LTD7
Top patents by PatentIndex Score
121 records- 0198US11877381B2Heat dissipating systemINVENTEC PUDONG TECH CORP·Filed 2022·Granted Jan 16, 2024·7 cites·8 claims
- 0298US9502821B2Flippable electrical connectorFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2015·Granted Nov 22, 2016·45 cites·20 claims
- 0398US9350126B2Electrical connector having a receptacle with a shielding plate and a mating plug with metallic side armsFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2014·Granted May 24, 2016·69 cites·16 claims
- 0497US11978677B2Wafer positioning method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·3 cites·20 claims
- 0597US9740253B2Electronic apparatusINVENTEC PUDONG TECH CORP·Filed 2016·Granted Aug 22, 2017·35 cites·7 claims
- 0697US9472910B2Flippable electrical connectorFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2014·Granted Oct 18, 2016·20 cites·17 claims
- 0795US9608391B2Flippable electrical connectorFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2016·Granted Mar 28, 2017·14 cites·17 claims
- 0893US12213277B2Air cooling systemINVENTEC PUDONG TECH CORP·Filed 2022·Granted Jan 28, 2025·2 cites·14 claims
- 0993US11337317B2Server deviceINVENTEC PUDONG TECH CORP·Filed 2020·Granted May 17, 2022·4 cites·3 claims
- 1093US7212404B2Integrated heat sink deviceINVENTEC CORP·Filed 2005·Granted May 1, 2007·36 cites·19 claims
- 1192US11831094B2Electrical connector assembly including a back plate having a curved inner region and a flat outer regionFOXCONN KUNSHAN COMPUTER CONNECTOR CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·6 claims
- 1292US9270035B2Carrier and carrier assembly used thereof for positioning IC packageHON HAI PREC IND CO LTD·Filed 2014·Granted Feb 23, 2016·11 cites·20 claims
- 1392US9214754B2Holding device used for electrical connectorHON HAI PREC IND CO LTD·Filed 2014·Granted Dec 15, 2015·11 cites·19 claims
- 1492US8262419B2Contact for electric connector and method of making the sameCHEN KE-HAO·Filed 2011·Granted Sep 11, 2012·17 cites·16 claims
- 1592US7405937B1Heat sink module for dual heat sourcesINVENTEC CORP·Filed 2007·Granted Jul 29, 2008·34 cites·11 claims
- 1692US7388747B2Heat plate fixing structureINVENTEC CORP·Filed 2006·Granted Jun 17, 2008·28 cites·10 claims
- 1791US9705267B2Electrical connector with grounding plate retained thereinFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2016·Granted Jul 11, 2017·11 cites·19 claims
- 1889US11776810B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
- 1989US11490283B2L1-SINR measurement period based on channel measurement resource (CMR) and interference measurement resource (IMR)MEDIATEK INC·Filed 2021·Granted Nov 1, 2022·2 cites·20 claims
- 2089US9748332B1Non-volatile semiconductor memoryMACRONIX INT CO LTD·Filed 2016·Granted Aug 29, 2017·8 cites·16 claims
- 2188US11411020B2Memory device with sub-slitsMACRONIX INT CO LTD·Filed 2020·Granted Aug 9, 2022·2 cites·18 claims
- 2287US7319592B2Recyclable protective cover for a heat-conductive mediumINVENTEC CORP·Filed 2006·Granted Jan 15, 2008·16 cites·14 claims
- 2385US9762009B2Plug connector insertable in two orientations and having a metallic shield plate with arms with hook structuresFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2016·Granted Sep 12, 2017·6 cites·20 claims
- 2485US7436673B2Heat sink fixing assemblyINVENTEC CORP·Filed 2006·Granted Oct 14, 2008·14 cites·14 claims
- 2585US7274572B2Supporting plateINVENTEC CORP·Filed 2005·Granted Sep 25, 2007·13 cites·8 claims
- 2684US8033872B2Contact terminal for test socketHON HAI PREC IND CO LTD·Filed 2011·Granted Oct 11, 2011·14 cites·13 claims
- 2784US7558062B2Heat-dissipating module and electronic apparatusINVENTEC CORP·Filed 2007·Granted Jul 7, 2009·17 cites·18 claims
- 2883US12315753B2Wafer positioning method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 2983US10948246B1Heat dissipation systemINVENTEC PUDONG TECH CORP·Filed 2019·Granted Mar 16, 2021·6 cites·8 claims
- 3083US2025299953A1Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3181US12347681B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 3281US12300506B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 3381US9382919B2Fan blade structureINVENTEC PUDONG TECH CORP·Filed 2013·Granted Jul 5, 2016·5 cites·9 claims
- 3479US7277293B2Heat sink conduction apparatusINVENTEC CORP·Filed 2005·Granted Oct 2, 2007·9 cites·8 claims
- 3579US2025253180A1Wafer positioning method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3678US8897012B2Electronic device and heat dissipation module thereofINVENTEC PUDONG TECH CORP·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 3778US2025364333A1Critical dimension uniformity (cdu) control methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3877US8641271B2Method for testing heat pipesWANG FENG-KU·Filed 2010·Granted Feb 4, 2014·4 cites·6 claims
- 3977US8033854B1IC socket having individual latch hingeHON HAI PREC IND CO LTD·Filed 2010·Granted Oct 11, 2011·3 cites·14 claims
- 4077US7564686B2Heat-dissipating moduleINVENTEC CORP·Filed 2007·Granted Jul 21, 2009·7 cites·8 claims
- 4176US11397453B2Heat dissipation systemINVENTEC PUDONG TECH CORP·Filed 2020·Granted Jul 26, 2022·1 cites·9 claims
- 4276US2024395581A1Semiconductor processing tool and method of using an embedded chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4375US2024387149A1Etch apparatus for compensating shifted overlayersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4474US9873109B2Catalysts for thermochemical fuel production and method of producing fuel using thermochemical fuel productionJAPAN SCIENCE & TECH AGENCY·Filed 2015·Granted Jan 23, 2018·1 cites·4 claims
- 4573US12191174B2Semiconductor processing tool and method of using an embedded chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 4673US9332666B2Electrical connector having an improved stiffenerHON HAI PREC IND CO LTD·Filed 2014·Granted May 3, 2016·2 cites·20 claims
- 4773US7589969B2Folding protective cover for heat-conductive mediumINVENTEC CORP·Filed 2006·Granted Sep 15, 2009·6 cites·9 claims
- 4872US12482654B2System and method for multiple step directional patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 4972US9029696B2Electronic deviceINVENTEC PUDONG TECH CORP·Filed 2013·Granted May 12, 2015·3 cites·22 claims
- 5072US7463484B2Heatsink apparatusINVENTEC CORP·Filed 2007·Granted Dec 9, 2008·5 cites·13 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →