Inventor · disambiguated record

Chiung-Kai Yang

Also filed as: YANG CHIUNG-KAI

1 granted patent·35 citations·filing 2001–2001

45Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD1

Top patents by PatentIndex Score

1 record

0176US6501164B1Multi-chip semiconductor package with heat dissipating structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Dec 31, 2002·35 cites·11 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →