Inventor · disambiguated record
Chung-Hsien Yang
Also filed as: YANG CHUNG · YANG CHUNG-HSIEN
11 granted patents·8 pending applications·203 citations·filing 1996–2025
89Inventor score
Files withIND TECH RES INST8AALTOSEMI INC3SILICONWARE PRECISION INDUSTRIES CO LTD2CHI MEI OPTOELECTRONICS CORP1H E W D ENTERPRISES AMERICA IN1
Top patents by PatentIndex Score
19 records- 0193US6433420B1Semiconductor package with heat sink having air ventSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 13, 2002·94 cites·9 claims
- 0283US11024055B2Vehicle, vehicle positioning system, and vehicle positioning methodIND TECH RES INST·Filed 2019·Granted Jun 1, 2021·9 cites·14 claims
- 0382US6877385B2Contact type micro piezoresistive shear-stress sensorNAT SCIENCE COUNCIL·Filed 2001·Granted Apr 12, 2005·32 cites·5 claims
- 0470US5688295AGasoline fuel additiveH E W D ENTERPRISES AMERICA IN·Filed 1996·Granted Nov 18, 1997·33 cites·10 claims
- 0567US10252701B2Object tracking system and method therewithIND TECH RES INST·Filed 2017·Granted Apr 9, 2019·2 cites·16 claims
- 0665US2025379007A1Key structure and input deviceLITE ON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0764US5931977ADiesel fuel additiveFiled 1997·Granted Aug 3, 1999·23 cites·3 claims
- 0860US9058735B2Method and system for detecting conditions of drivers, and electronic apparatus thereofIND TECH RES INST·Filed 2014·Granted Jun 16, 2015·2 cites·30 claims
- 0955US6987311B2Thin film transistors of a thin film transistor liquid crystal display and method for fabricating the sameCHI MEI OPTOELECTRONICS CORP·Filed 2003·Granted Jan 17, 2006·8 cites·10 claims
- 1053US2010132736A1Test Cell Conditioner (TCC) Surrogate Cleaning DeviceJTRON TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 1146US2025372400A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 1244US10685263B2System and method for object labelingIND TECH RES INST·Filed 2018·Granted Jun 16, 2020·0 cites·14 claims
- 1344US2025308937A1Manufacturing method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 1441US11100702B23D image labeling method based on labeling information of 2D image and 3D image labeling deviceIND TECH RES INST·Filed 2019·Granted Aug 24, 2021·0 cites·8 claims
- 1540US2007082582A1Apparatus for endpoint detection during polishingIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1639US2025253261A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 1738US11373520B2Method and device for sensing traffic environmentIND TECH RES INST·Filed 2019·Granted Jun 28, 2022·0 cites·18 claims
- 1837US2006281228A1Lead-frame type semiconductor package and lead frame thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 1928US2016247538A1Event reconstruction system and method thereofIND TECH RES INST·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →