Inventor · disambiguated record
Chih-An Yang
Also filed as: YANG CHIH-AN
11 granted patents·7 pending applications·110 citations·filing 2003–2024
89Inventor score
Files withVIA TECH INC8TAIWAN SEMICONDUCTOR MFG CO LTD4MSTAR SEMICONDUCTOR INC2YANG CHIH-AN2MEDIATEK INC1
Top patents by PatentIndex Score
18 records- 0197US11373971B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·5 cites·20 claims
- 0296US11756913B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·3 cites·20 claims
- 0393US12068271B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·1 cites·20 claims
- 0491US6756664B2Noise eliminating system on chip and method of making sameVIA TECH INC·Filed 2003·Granted Jun 29, 2004·70 cites·14 claims
- 0582US2024371810A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0674US9640475B1Chip packaging structure and manufacturing method thereofMSTAR SEMICONDUCTOR INC·Filed 2016·Granted May 2, 2017·3 cites·24 claims
- 0772US7310224B2Electronic apparatus with thermal moduleVIA TECH INC·Filed 2005·Granted Dec 18, 2007·5 cites·19 claims
- 0871US7868439B2Chip package and substrate thereofVIA TECH INC·Filed 2006·Granted Jan 11, 2011·5 cites·20 claims
- 0965US7126211B2Circuit carrierVIA TECH INC·Filed 2004·Granted Oct 24, 2006·13 cites·7 claims
- 1054US7102230B2Circuit carrier and fabrication method thereofVIA TECH INC·Filed 2004·Granted Sep 5, 2006·5 cites·10 claims
- 1145US7355275B2Chip package and fabricating method thereofVIA TECH INC·Filed 2005·Granted Apr 8, 2008·0 cites·20 claims
- 1245US2010032824A1IC Package Method Capable of Decreasing IR Drop and Associated IC ApparatusMSTAR SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1343US11694972B2Semiconductor package with heatsinkMEDIATEK INC·Filed 2021·Granted Jul 4, 2023·0 cites·17 claims
- 1440US2015100986A1Controlling method for recording digital television programsWISTRON CORP·Filed 2014·Application pending·0 cites
- 1539US2006249844A1Contact structure on chip and package thereofVIA TECH INC·Filed 2005·Application pending·0 cites
- 1639US2006079021A1Method for flip chip package and structure thereofVIA TECH INC·Filed 2005·Application pending·0 cites
- 1739US2005241851A1Pin grid array package carrier and process of mounting passive component thereonYANG CHIH-AN·Filed 2004·Application pending·0 cites
- 1837US2006043577A1Structure and process of semiconductor package with an exposed heatsinkYANG CHIH-AN·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →