Inventor · disambiguated record
Chufeng Yang
Also filed as: YANG CHUFENG
1 granted patent·3 pending applications·0 citations·filing 2021–2023
8Inventor score
Files withHANGZHOU FIRST APPLIED MAT CO LTD4
Top patents by PatentIndex Score
4 records- 0162US2025388769A1Ink Composition, Package Structure and Semiconductor DeviceHANGZHOU FIRST APPLIED MAT CO LTD·Filed 2023·Application pending·0 cites
- 0257US2024368419A1An Ink Composition for OLED Packaging and An Application thereofHANGZHOU FIRST APPLIED MAT CO LTD·Filed 2022·Application pending·0 cites
- 0344US11987734B2Anti-PID encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing methodHANGZHOU FIRST APPLIED MAT CO LTD·Filed 2021·Granted May 21, 2024·0 cites·9 claims
- 0441US2024030361A1A Patterned Adhesive Film and a Photovoltaic AssemblyHANGZHOU FIRST APPLIED MAT CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →