Inventor · disambiguated record
Chen-Tsai Yang
Also filed as: YANG CHEN-TSAI
8 granted patents·7 pending applications·5 citations·filing 2017–2024
74Inventor score
Files withIND TECH RES INST15
Top patents by PatentIndex Score
15 records- 0181US10757804B1Flexible hybrid electronic system and method of reducing the impact thereofIND TECH RES INST·Filed 2020·Granted Aug 25, 2020·2 cites·20 claims
- 0274US10384434B2Separating device and separating methodIND TECH RES INST·Filed 2018·Granted Aug 20, 2019·3 cites·17 claims
- 0359US2025081347A1Electrical connection deviceIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0458US2024341653A1Flexible electronic deviceIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0555US2025073752A1Thin film deformation element and multi-tactile feedback componentIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0651US12232256B2Flexible hybrid electronic substrate and electronic textile including the sameIND TECH RES INST·Filed 2022·Granted Feb 18, 2025·0 cites·12 claims
- 0750US2024004474A1Film deformation element, haptic feedback unit and haptic feedback systemIND TECH RES INST·Filed 2023·Application pending·0 cites
- 0848US11646259B2Redistribution structure and forming method thereofIND TECH RES INST·Filed 2021·Granted May 9, 2023·0 cites·15 claims
- 0947US2023140585A1Multiple sensor-fusing based interactive training system and multiple sensor-fusing based interactive training methodIND TECH RES INST·Filed 2022·Application pending·0 cites
- 1045US11362045B2Chip package structureIND TECH RES INST·Filed 2020·Granted Jun 14, 2022·0 cites·19 claims
- 1141US2020211984A1Electronic device package structure and manufacturing method thereofIND TECH RES INST·Filed 2019·Application pending·0 cites
- 1241US2020185344A1Chip package structureIND TECH RES INST·Filed 2019·Application pending·0 cites
- 1339US10622326B2Chip package structureIND TECH RES INST·Filed 2018·Granted Apr 14, 2020·0 cites·15 claims
- 1437US10249567B2Redistribution layer structure of semiconductor packageIND TECH RES INST·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 1536US10461035B2Semiconductor package structureIND TECH RES INST·Filed 2017·Granted Oct 29, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →