Inventor · disambiguated record
Che-Chia Yang
Also filed as: YANG CHE-CHIA
30 granted patents·17 pending applications·27 citations·filing 2019–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD47
Top patents by PatentIndex Score
47 records- 0198US11749644B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·5 cites·20 claims
- 0298US11264359B2Chip bonded to a redistribution structure with curved conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·10 cites·20 claims
- 0397US11784130B2Structure and formation method of package with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·3 cites·20 claims
- 0494US12261102B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·2 cites·16 claims
- 0594US11699668B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·2 cites·20 claims
- 0693US12322703B2Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
- 0787US2025357368A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0886US10790164B1Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·4 cites·20 claims
- 0986US2025349687A1Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1084US12444696B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 1184US12387991B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1284US2025323115A1Chip package structure with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1383US12406898B2Chip package structure with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 1483US2025316543A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1583US2025323106A1Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1683US2024371783A1Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1782US12322704B2Package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1882US2025300093A1Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1981US12100664B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 2081US2025273581A1Package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2181US2025069982A1Semiconductor die package with multi-lid structures and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2279US12368114B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 2379US12237276B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·11 claims
- 2479US2025266365A1Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2579US2024387335A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2679US2024387339A1Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2779US2024371829A1Method of forming a semiconductor device package having dummy diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2878US12170238B2Semiconductor die package with multi-lid structures and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 2976US12368080B2Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 3076US11855008B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3175US12266635B2Semiconductor device package having dummy diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 3274US11855004B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 3374US2025201686A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3473US12033906B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 3573US2025157949A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3672US2024304559A1Chip package structure with buffer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3771US12033913B2Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 3871US11721643B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 3970US11694941B2Semiconductor die package with multi-lid structures and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 4069US12094828B2Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 17, 2024·0 cites·20 claims
- 4169US11670601B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
- 4268US12148684B2Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 19, 2024·0 cites·20 claims
- 4368US12125822B2Method of manufacturing a semiconductor device package having dummy diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 4468US11728233B2Chip package structure with ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 4566US11978722B2Structure and formation method of package containing chip structure with inclined sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 4665US11990418B2Chip package structure with buffer structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 4750US2023063295A1Package structure with stiffener ring having slant sidewallTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →