Inventor · disambiguated record
Chao-Ya Yang
Also filed as: YANG CHAO-YA
11 granted patents·2 pending applications·42 citations·filing 2010–2021
86Inventor score
Top patents by PatentIndex Score
13 records- 0188US8912959B2Packaging structure and method of fabricating the sameCHIU CHIH-HSIEN·Filed 2012·Granted Dec 16, 2014·16 cites·22 claims
- 0287US8264070B2Package structure with ESD and EMI preventing functionsTSAI TSUNG-HSIEN·Filed 2010·Granted Sep 11, 2012·11 cites·11 claims
- 0384US8963299B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 24, 2015·8 cites·22 claims
- 0479US9508656B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·8 claims
- 0567US10230152B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 12, 2019·2 cites·8 claims
- 0666US9899335B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·1 cites·7 claims
- 0763US11723144B2Electronic device and circuit board thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·4 claims
- 0851US11764162B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Sep 19, 2023·0 cites·18 claims
- 0948US10587037B2Electronic package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 10, 2020·0 cites·20 claims
- 1047US11069633B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Jul 20, 2021·0 cites·12 claims
- 1143US9502377B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·0 cites·11 claims
- 1232US2016081234A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 1332US2016155559A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →