Inventor · disambiguated record
Chin-Tsai Yao
Also filed as: YAO CHIN-TSAI
15 granted patents·6 pending applications·45 citations·filing 2010–2019
90Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD17YAO CHIN-TSAI2LIN CHANG-FU1SILICONWARE PREC IND CO L1
Top patents by PatentIndex Score
21 records- 0190US8736030B2Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the sameYAO CHIN-TSAI·Filed 2010·Granted May 27, 2014·14 cites·7 claims
- 0285US10522453B2Substrate structure with filling material formed in concave portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 31, 2019·4 cites·11 claims
- 0385US10510720B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 17, 2019·5 cites·30 claims
- 0485US8963298B2EMI shielding package structure and method for fabricating the sameYAO CHIN-TSAI·Filed 2010·Granted Feb 24, 2015·7 cites·10 claims
- 0584US9190387B2Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding functionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 17, 2015·6 cites·12 claims
- 0672US9842771B2Semiconductor device and fabrication method thereof and semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 12, 2017·3 cites·13 claims
- 0767US9013042B2Interconnection structure for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 21, 2015·3 cites·11 claims
- 0866US9900996B2Package substrate and structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·2 cites·17 claims
- 0960US9607963B2Semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Mar 28, 2017·1 cites·12 claims
- 1059US11973014B2Method of manufacturing substrate structure with filling material formed in concave portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Apr 30, 2024·0 cites·7 claims
- 1155US10679932B2Semiconductor package and a substrate for packagingSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 9, 2020·0 cites·16 claims
- 1249US9666453B2Semiconductor package and a substrate for packagingLIN CHANG-FU·Filed 2012·Granted May 30, 2017·0 cites·6 claims
- 1347US9520351B2Packaging substrate and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 13, 2016·0 cites·36 claims
- 1447US9425152B2Method for fabricating EMI shielding package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·9 claims
- 1546US9368467B2Substrate structure and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Jun 14, 2016·0 cites·13 claims
- 1645US2015004752A1Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1745US2017148679A1Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1843US2015235914A1Flip-chip packaging substrate, flip-chip package and fabrication methods thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1938US2013334684A1Substrate structure and package structureSILICONWARE PREC IND CO L·Filed 2012·Application pending·0 cites
- 2036US2018130774A1Package stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2134US2016099204A1Package substrate, package structure, and methods of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →