Inventor · disambiguated record
Chung-Mao Yeh
Also filed as: YEH CHUNG-MAO
0 granted patents·7 pending applications·0 citations·filing 2008–2008
Technology areasH10W
Files withLINGSEN PRECISION IND LTD7
Top patents by PatentIndex Score
7 records- 0147US2009286355A1Flip-chip process by photo-curing adhesiveLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 0247US2009239341A1Ic packaging processLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 0347US2009186450A1Ic packaging process by photo-curing adhesiveLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 0447US2009178758A1Method of arranging stacked chip by photo-curing adhesiveLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 0546US2009239339A1Method of stacking dies for die stack packageLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 0646US2009236712A1Ic package having reduced thicknessLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 0745US2009181499A1Ic packaging processLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →