Inventor · disambiguated record
Chao-Yang Yeh
Also filed as: YEH CHAO-YANG
23 granted patents·2 pending applications·118 citations·filing 2011–2023
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12TAIWAN SEMICONDUCTOR MFG5MEDIATEK INC2CHEN CHIH-CHIA1GOEL SANDEEP KUMAR1
Top patents by PatentIndex Score
25 records- 0195US10262974B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 16, 2019·11 cites·20 claims
- 0295US9190345B1Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 17, 2015·24 cites·20 claims
- 0393US10535638B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·7 cites·20 claims
- 0492US9385110B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·10 cites·20 claims
- 0592US8269350B1Reducing the switching noise on substrate with high grounding resistanceCHEN CHIH-CHIA·Filed 2011·Granted Sep 18, 2012·21 cites·20 claims
- 0688US8402404B1Stacked die interconnect validationMEHTA ASHOK·Filed 2011·Granted Mar 19, 2013·10 cites·20 claims
- 0787US8910101B1Systems and methods for determining effective capacitance to facilitate a timing analysisTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 9, 2014·10 cites·20 claims
- 0880US10861830B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 8, 2020·1 cites·20 claims
- 0979US9817029B2Test probing structureWANG MILL-JER·Filed 2011·Granted Nov 14, 2017·4 cites·20 claims
- 1078US9646128B2System and method for validating stacked dies by comparing connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 9, 2017·2 cites·20 claims
- 1178US8856710B2Tool and method for modeling interposer RC couplingsYEH CHAO-YANG·Filed 2011·Granted Oct 7, 2014·8 cites·20 claims
- 1276US9660017B2Microelectronic package with surface mounted passive elementMEDIATEK INC·Filed 2015·Granted May 23, 2017·3 cites·9 claims
- 1371US9741688B2Method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·1 cites·20 claims
- 1470US9003338B2Common template for electronic articleTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 7, 2015·2 cites·20 claims
- 1569US11585831B2Test probing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 1669US9104835B2Systems and methods for determining effective capacitance to facilitate a timing analysisTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 11, 2015·2 cites·20 claims
- 1764US9704766B2Interposers of 3-dimensional integrated circuit package systems and methods of designing the sameGOEL SANDEEP KUMAR·Filed 2011·Granted Jul 11, 2017·2 cites·20 claims
- 1857US10002854B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·20 claims
- 1956US10782318B2Test probing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·0 cites·20 claims
- 2054US9047432B2System and method for validating stacked dies by comparing connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·0 cites·15 claims
- 2151US9613174B2Common template for electronic articleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 2250US9385073B2Packages having integrated devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·0 cites·20 claims
- 2349US9542517B2Techniques for fast resonance convergenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·0 cites·19 claims
- 2446US2024345941A1Core test method and core test circuitMEDIATEK SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 2534US2016197071A1Integrated circuit device and method for forming the sameMEDIATEK INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →