Inventor · disambiguated record
Ching-Fu Yeh
Also filed as: YEH CHING-FU
25 granted patents·11 pending applications·49 citations·filing 2012–2024
94Inventor score
Top patents by PatentIndex Score
36 records- 0194US8735280B1Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 27, 2014·13 cites·19 claims
- 0288US9613854B2Method and apparatus for back end of line semiconductor device processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·6 cites·20 claims
- 0388US9142505B2Method and apparatus for back end of line semiconductor device processingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·9 cites·20 claims
- 0486US10164018B1Semiconductor interconnect structure having graphene-capped metal interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·4 cites·20 claims
- 0583US9640431B2Method for via plating with seed layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 2, 2017·2 cites·20 claims
- 0682US9054163B2Method for via plating with seed layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 9, 2015·3 cites·20 claims
- 0781US9054161B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 9, 2015·3 cites·20 claims
- 0880US9966304B2Method for forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·3 cites·20 claims
- 0976US9966339B2Barrier structure for copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 8, 2018·4 cites·20 claims
- 1073US2024321632A1Semiconductor device including liner structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1172US2024203789A1Semiconductor structure having vertical conductive graphene and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1271US9324608B2Method for via plating with seed layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 26, 2016·1 cites·20 claims
- 1367US11948837B2Semiconductor structure having vertical conductive graphene and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1465US10930552B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 1564US9142509B2Copper interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 22, 2015·1 cites·20 claims
- 1660US12027419B2Semiconductor device including liner structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
- 1760US10651279B2Semiconductor interconnect structure having graphene-capped metal interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 1860US10453746B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 1959US9947583B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 17, 2018·0 cites·20 claims
- 2057US2017236750A1Method for Via Plating with Seed LayerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Application pending·0 cites
- 2156US9570347B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·0 cites·20 claims
- 2256US2025300012A1Interconnect structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2356US2025293087A1Semiconductor device including super via and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2455US9607891B2Aluminum interconnection apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 28, 2017·0 cites·20 claims
- 2554US2025079313A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2652US2023387239A1Semiconductor device including graphene barrier and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2751US2023154791A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2850US9455184B2Aluminum interconnection apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 2950US9391023B2Method for producing salicide and a carbon nanotube metal contactTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 12, 2016·0 cites·19 claims
- 3050US2024055352A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3149US2023352409A1Interconnect structure including single layer serving as both barrier layer and liner layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3248US9984975B2Barrier structure for copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 29, 2018·0 cites·20 claims
- 3348US2015001720A1Interconnect Structure and Method for Forming Interconnect StructureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 3446US10163698B2Interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·0 cites·20 claims
- 3546US8941239B2Copper interconnect structure and method for forming the sameYU CHEN-HUA·Filed 2012·Granted Jan 27, 2015·0 cites·20 claims
- 3645US8772934B2Aluminum interconnection apparatusYEH CHING-FU·Filed 2012·Granted Jul 8, 2014·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →