Inventor · disambiguated record
Chan-Wei Yeh
Also filed as: YEH CHAN-WEI
1 granted patent·3 pending applications·0 citations·filing 2011–2024
7Inventor score
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4 records- 0155US2025372552A1Bonded structure with half-oval bonding pad pair design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0252US2025054871A1Systems for visible wavelength measurement of overlay of wafer-on-wafer bonding and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0337US2012325300A1Inverted metamorphic (imm) solar cell semiconductor structure and laser lift-off method for the sameYEH CHAN-WEI·Filed 2011·Application pending·0 cites
- 0431US8668346B2Simulated sunlight generating deviceWU CHIH-HUNG·Filed 2011·Granted Mar 11, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →