Inventor · disambiguated record
Chang-Lin Yeh
Also filed as: YEH CHANG-LIN
37 granted patents·10 pending applications·56 citations·filing 2005–2025
96Inventor score
Top patents by PatentIndex Score
47 records- 0195US11626360B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0293US11410899B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0392US10629454B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 21, 2020·7 cites·23 claims
- 0492US10580713B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 3, 2020·6 cites·21 claims
- 0592US10096578B1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 9, 2018·8 cites·23 claims
- 0691US12364008B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 15, 2025·1 cites·9 claims
- 0787US7329900B2Bonding strength testing deviceADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Feb 12, 2008·12 cites·14 claims
- 0886US11997888B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted May 28, 2024·1 cites·16 claims
- 0986US11133244B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 28, 2021·3 cites·24 claims
- 1084US2025344505A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1183US2024429115A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1281US11224132B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 11, 2022·2 cites·19 claims
- 1381US10381300B2Semiconductor device package including filling mold viaADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 13, 2019·4 cites·26 claims
- 1480US12176276B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1580US12089349B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Sep 10, 2024·0 cites·15 claims
- 1680US11462455B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 4, 2022·4 cites·17 claims
- 1778US12087652B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Sep 10, 2024·0 cites·17 claims
- 1876US2025316556A1Electronic package and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1974US11744024B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Aug 29, 2023·0 cites·14 claims
- 2073US12186094B2Wearable deviceADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 7, 2025·0 cites·17 claims
- 2173US2025134456A1Wearable deviceADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2272US2024145357A1Electronic assemblyADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 2370US12334412B2Electronic package and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jun 17, 2025·0 cites·8 claims
- 2470US11942385B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Mar 26, 2024·0 cites·14 claims
- 2568US11862544B2Electronic assemblyADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 2, 2024·0 cites·18 claims
- 2668US10411766B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 10, 2019·1 cites·23 claims
- 2766US11710689B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jul 25, 2023·0 cites·19 claims
- 2866US11222792B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 11, 2022·0 cites·23 claims
- 2962US8421242B2Semiconductor packageCHANG HSIAO-CHUAN·Filed 2009·Granted Apr 16, 2013·2 cites·6 claims
- 3061US11437415B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 6, 2022·0 cites·19 claims
- 3160US11289394B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 29, 2022·0 cites·19 claims
- 3257US11575995B2Semiconductor package device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 7, 2023·0 cites·17 claims
- 3357US10861779B2Semiconductor device package having an electrical contact with a high-melting-point part and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 8, 2020·0 cites·25 claims
- 3456US11948852B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 2, 2024·0 cites·14 claims
- 3555US11201200B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 14, 2021·0 cites·15 claims
- 3654US10332849B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 25, 2019·0 cites·20 claims
- 3752US11081473B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·0 cites·21 claims
- 3852US10991656B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 27, 2021·0 cites·25 claims
- 3951US11211302B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 28, 2021·0 cites·19 claims
- 4051US2023026633A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 4150US10074622B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
- 4249US2022336317A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 4344US2007222047A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 4443US10483254B2Electronic module and semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 19, 2019·0 cites·18 claims
- 4542US10438889B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Oct 8, 2019·0 cites·22 claims
- 4642US2020312733A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 4740US2005224936A1Chip package structureWU JENG-DAH·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →