Inventor · disambiguated record
Chen-Hsuan Yen
Also filed as: YEN CHEN-HSUAN
4 granted patents·4 pending applications·4 citations·filing 2017–2024
64Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
Top patents by PatentIndex Score
8 records- 0177US11658088B2Structures and methods for heat dissipation of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·1 cites·20 claims
- 0277US10910290B2Structures and methods for heat dissipation of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 2, 2021·3 cites·16 claims
- 0376US2024359969A1Micro-electromechanical system device using a metallic movable part and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0472US12230550B2Structures and methods for heat dissipation of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0570US12122665B2Micro-electromechanical system device using a metallic movable part and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 0658US2025285923A1Semiconductor device including a test line portion and method of making and testing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0754US2024395729A1Chip package structure and method for preventing warpage of chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0854US2024404965A1Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →