Inventor · disambiguated record
Choongbin Yim
Also filed as: YIM CHOONGBIN
20 granted patents·37 pending applications·92 citations·filing 2007–2025
92Inventor score
Top patents by PatentIndex Score
57 records- 0195US8779606B2Package-on-package electronic devices including sealing layers and related methods of forming the sameYIM CHOONGBIN·Filed 2013·Granted Jul 15, 2014·55 cites·18 claims
- 0294US12388029B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·3 cites·18 claims
- 0389US11367688B2Semiconductor package with interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0484US10770446B2Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·4 cites·18 claims
- 0582US8338941B2Semiconductor packages and methods of fabricating the sameLEE JINHO·Filed 2010·Granted Dec 25, 2012·9 cites·20 claims
- 0682US2025391827A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0777US9245867B2Package-on-package electronic devices including sealing layers and related methods of forming the sameYIM CHOONGBIN·Filed 2014·Granted Jan 26, 2016·4 cites·11 claims
- 0877US9245772B2Stackable package by using internal stacking modulesSTATS CHIPPAC LTD·Filed 2014·Granted Jan 26, 2016·4 cites·23 claims
- 0977US2025349746A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1075US7800211B2Stackable package by using internal stacking modulesSTATS CHIPPAC LTD·Filed 2007·Granted Sep 21, 2010·8 cites·17 claims
- 1171US12021036B2Semiconductor package including interposer and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1269US11798889B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1368US12424601B2Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·8 claims
- 1467US9035308B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 19, 2015·2 cites·20 claims
- 1564US11521934B2Semiconductor package including interposer and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 6, 2022·0 cites·19 claims
- 1663US2025349731A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1761US2025087634A1Semiconductor packages and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1861US2025096098A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1961US2025062260A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2061US2025149460A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2160US2025022834A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2260US2024404921A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2360US2024274579A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2460US2025046721A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2560US2024379635A13d integrated circuit (3dic) structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2660US2024421123A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2760US2025022844A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2859US12148729B2Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·19 claims
- 2959US2024355794A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3059US2024258222A13d integrated circuit (3dic) structures and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3159US2024258221A13d integrated circuit (3dic) structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3259US2024339411A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3359US2024395720A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3458US2024321851A1Semiconductor packages and method for manufacturing the sameSAMSUNG ELECTERONICS CO LTD·Filed 2023·Application pending·0 cites
- 3558US2024128174A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3657US8569114B2Method of forming a semiconductor device packageYIM CHOONGBIN·Filed 2010·Granted Oct 29, 2013·1 cites·18 claims
- 3757US2023402358A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3857US2024234279A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3957US2024047418A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4057US2024290762A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4156US12512398B2Semiconductor package having semiconductor chip positioned in cavity of cover wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·19 claims
- 4256US2024088005A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4355US2023361051A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4455US2024063181A1Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4552US11854989B2Semiconductor package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4651US11710673B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4751US2023021867A1Semiconductor package including a lower substrate and an upper substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4851US2024079285A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4950US2025357445A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 5049US2025336835A1Semiconductor package including an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →