Inventor · disambiguated record
Cheol-Joon Yoo
Also filed as: YOO CHEOL J · YOO CHEOL-JOON
11 granted patents·10 pending applications·238 citations·filing 2001–2010
91Inventor score
Top patents by PatentIndex Score
21 records- 0194US7298033B2Stack type ball grid array package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 20, 2007·93 cites·29 claims
- 0292US7170158B2Double-sided circuit board and multi-chip package including such a circuit board and method for manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 30, 2007·73 cites·15 claims
- 0377US7485959B2Structure for joining a semiconductor package to a substrate using a solder columnSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 3, 2009·2 cites·14 claims
- 0475US7939924B2Stack type ball grid array package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 10, 2011·6 cites·23 claims
- 0575US6869264B2Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tapeSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 22, 2005·14 cites·10 claims
- 0670US7129585B2Semiconductor device and method of packaging the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 31, 2006·15 cites·17 claims
- 0769US7284941B2Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tapeSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 23, 2007·9 cites·7 claims
- 0867US7129118B2Protective tape removing apparatus and method of assembling semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 31, 2006·11 cites·15 claims
- 0965US7465142B2Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tapeSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 16, 2008·7 cites·7 claims
- 1062US6808379B2Cleaner for molding apparatus of semiconductor chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 26, 2004·8 cites·15 claims
- 1150US2009166061A1PCB strip, PCB strip assembly device using the PCB strip, a method of using the PCB strip assembly device, and a method of fabricating a PCB stripYOO CHEOL-JOON·Filed 2008·Application pending·0 cites
- 1249US7279360B2Semiconductor device and method of packaging the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 9, 2007·0 cites·1 claims
- 1347US2007096288A1Double-sided circuit board and multi-chip package including such a circuit board and method for manufactureCHOI HEE K·Filed 2006·Application pending·0 cites
- 1446US2010013079A1Package substrate, semiconductor package having a package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1544US2008111284A1Method of manufacturing a molding structure, and method and apparatus for molding a substrate using the molding structureSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1644US2008308935A1Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1744US2008296780A1Memory devices including separating insulating structures on wires and methods of formingSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1839US2004158978A1Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCBFiled 2004·Application pending·0 cites
- 1939US2005269715A1Semiconductor package, mold used in manufacturing the same, and method for manufacturing the sameYOO CHEOL-JOON·Filed 2005·Application pending·0 cites
- 2037US2011169195A1Molding apparatus and molding methodYOO CHEOL-JOON·Filed 2010·Application pending·0 cites
- 2137US2005280503A1Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unitLEE SANG-WOO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →